Blogs
21 Aug 2026
- by KINGBROTHER
- Blogs
Edge AI Accelerator Hardware Architecture and PCB Design Essentials
Edge AI is entering scaled deployment. This guide covers edge AI accelerator hardware architecture and PCB design essentials, from GPU/ASIC/FPGA/NPU routes to power, thermal, and HDI manufacturing.
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21 Aug 2026
- by KINGBROTHER
- Blogs
Hardware Design and Manufacturing Considerations for Industrial Edge Computing Gateways
Industrial edge gateways require multi-protocol connectivity, harsh-environment operation, and long-term reliability. This guide covers processor platforms, PCB design, and reliability manufacturing.
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20 Aug 2026
- by KINGBROTHER
- Blogs
China's First Humanoid Robot Company Goes Public, and Humanoid Robots Formally Move Toward Mass Production
Unitree listed on the STAR Market on August 19 as the humanoid robot industry keeps moving toward mass production. This article looks at shipment targets, joint rigid-flex boards, and mass producti...
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20 Aug 2026
- by KINGBROTHER
- Blogs
THECA 2026 Preview: The Supply Chain Shift Behind Southeast Asia's Doubling PCB Capacity
THECA 2026 runs August 26-28 at BITEC Bangkok. Drawing on show information and regional capacity data, this preview maps the rise of the Southeast Asia PCB cluster, output growth in Thailand and Vi...
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20 Aug 2026
- by KINGBROTHER
- Blogs
WRC 2026 | KINGBROTHER Joins Industry Partners to Build the Hardware Foundation for Physical AI
At WRC 2026, KINGBROTHER joined industry partners to strengthen the hardware foundation for Physical AI, from embodied-intelligence robots and on-device computing to IPDM engineering support.
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19 Aug 2026
- by KINGBROTHER
- Blogs
2026 WRC: Humanoid Robots Step Off the Stage, and the Robot PCB Supply Chain Enters the Delivery Phase
The 2026 World Robot Conference opened with humanoid robots moving into real-world deployment. This article looks at the shift toward mass production of embodied intelligence and unpacks the delive...
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02 Aug 2026
- by KINGBROTHER
- Blogs
electronica Shanghai 2026 Conclusion - Price Increase, 224G PAM4 Mass Production, and Robot Output Behind Industry Signals
The entire industry chain has concentrated price increases, the supply and demand gap for high-end PCBs continues to expand, and Tesla Optimus has entered the mass production stage...
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02 Aug 2026
- by KINGBROTHER
- Blogs
Why do the three PCB subsystems of the energy storage system require different design ideas
In-depth analysis of the PCB design differentiation logic of the three subsystems of the energy storage system BMS, PCS, and EMS, from signal acquisition, power conversion...
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02 Aug 2026
- by KINGBROTHER
- Blogs
Reliability design and verification of industrial control PCB in harsh environments
Industrial PCB, harsh environment reliability, high TG material, triple-protective coating, ISO/IEC17025, IPC-6012, gold sinking process, heat dissipation design, rigid-flexible composite board...
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02 Aug 2026
- by KINGBROTHER
- Blogs
Df parameters and manufacturing process of M9 low-loss material in 224G high-speed PCB
In-depth analysis of Df/Dk temperature drift characteristics and manufacturing process of M9 low-loss material at 224G PAM4 signal rate...
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02 Aug 2026
- by KINGBROTHER
- Blogs
CoWoS and ABF carrier board, how do the two routes of advanced packaging divert PCB demand?
The CoWoS silicon interposer route and Coupon substrate de-interposer route are compared and analyzed, and the different shunt effects of the two routes on ABF carrier board...
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22 Jul 2026
- by KINGBROTHER
- Blogs
CHTF 2026 Outlook: PCB Requirements Map under the intersection of AI hardware, embodied intelligence and energy storage technologies
The 28th China International * Technology Fair (CHTF2026) will be held in Shenzhen in November 2026...
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