Blogs
03 Jul 2026
- by KINGBROTHER
- Blogs
electronica Shanghai 2026 Conclusion - Price Increase, 224G PAM4 Mass Production, and Robot Output Behind Industry Signals
The entire industry chain has concentrated price increases, the supply and demand gap for high-end PCBs continues to expand, and Tesla Optimus has entered the mass production stage...
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30 Jun 2026
- by KINGBROTHER
- Blogs
Observation of the Munich Electronics Show and WAIC Exhibition-Two intersection lines in the electronics industry
The Shanghai Electronics Show in Munich and the WAIC World Artificial Intelligence Conference were held in Shanghai.
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26 Jun 2026
- by KINGBROTHER
- Blogs
Digital power and energy network upgrade: smart hardware base PCB design
The digital upgrade of smart grids promotes changes in PCB design for substations and distribution network terminals. From IEC 61850 Ethernet communication boards to merge units and feeder terminals
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26 Jun 2026
- by KINGBROTHER
- Blogs
Industrial PCB reliability design in harsh environments: from material selection to verification testing
Industrial automation equipment places strict requirements on PCB reliability in harsh environments such as high temperature, vibration, corrosion, and electromagnetic interference.
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23 Jun 2026
- by KINGBROTHER
- Blogs
North American industrial automation PCB needs upgrade from Automate 2026: high-TG sheet, multi-layer design and long-life verification
Automate 2026: High-TG, 30-yr life, full traceability – new PCB standards for North American industrial automation.
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23 Jun 2026
- by KINGBROTHER
- Blogs
Automate 2026 On-site Observation: PCB supply chain signals revealed by Automation North America
Automate 2026 PCB trends: humanoid robots, edge AI, and Cobots raise layer count, speed, reliability. How Chinese suppliers meet new North American certification & traceability demands
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16 Jun 2026
- by KINGBROTHER
- Blogs
Energy Storage System PCB Design: Circuit Board Design for BMS, PCS, and EMS Subsystems
Energy storage system pcb design covers circuit board design for BMS, PCS, and EMS subsystems. From precision sampling to high-current power boards, this article breaks down the key technical consi...
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16 Jun 2026
- by KINGBROTHER
- Blogs
BMS Data Acquisition PCB: Engineering Practice for High-Precision Sampling and Isolation Design
The core of the bms pcb design of the BMS data acquisition board lies in high-precision sampling and isolation communication. From AFE chip selection to anti-interference of differential traces, fr...
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13 Jun 2026
- by KINGBROTHER
- Blogs
On-Device AI Is Changing Smartphone PCB Design
WWDC 2026 and the rise of AI PC show that on-device AI is becoming a mainstream hardware requirement. This article explains how NPUs, local memory, power density, and thermal constraints are chang...
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13 Jun 2026
- by KINGBROTHER
- Blogs
HDI design points for AI robot control system PCB
Focusing on the design requirements of the ai robot control system pcb, analyze the design points of HDI, rigid-flexible combination, thick copper, EMC and DFM in the AI robot perception layer, dec...
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13 Jun 2026
- by KINGBROTHER
- Blogs
Application of high thermal conductivity pcb in AI accelerator thermal management
The power consumption of AI accelerators is moving from hundreds of watts to kilowatts, and the high thermal conductivity pcb has become a key link in the thermal management chain. This paper analy...
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13 Jun 2026
- by KINGBROTHER
- Blogs
Advanced Packaging Queues Put ABF Substrates Under Pressure
TSMC reported 30.1% year-over-year May revenue growth on June 10. This article explains how advanced packaging, ABF substrates, high-density PCBs, and AI accelerator delivery are creating new const...
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