Solution OverviewAgainst the backdrop of the rapid development of the new power system and new energy infrastructure, high reliability, high precision and strong anti-interference ability have become the core requirements for power electronic equipment. We offer comprehensive solutions covering key links such as signal control, battery management, power measurement and thyristor triggering for the power industry, contributing to the stable and efficient operation of major national energy projects.
The following four typical cases demonstrate our technical strength and engineering implementation capabilities in scenarios such as high-voltage direct current transmission, smart grids, and energy storage systems.
Customers need to achieve high-precision signal acquisition, multi-protocol communication compatibility and real-time fault analysis in power equipment, but they are confronted with serious signal interference, difficult fault location, insufficient system stability and high maintenance costs.
We adopt a multi-channel optocoupler isolation acquisition + cloud data analysis architecture, supporting "second-level fault location" and "OTA remote upgrade". The PCB adopts a four-layer hierarchical isolation design (signal/power/ground/shielding), the main control chip is XC6VLX75T-1FFG484C (supporting VME64x bus), and the communication is realized by the VSC8574XKS-04 Gigabit Ethernet chip. Supports 2 electrical ports + 4 optical ports.
This scheme significantly enhances the system's performance and reliability.
| Key indicators | Achievements |
|---|---|
| Signal error | <0.05% |
| The efficiency of fault location has increased by 90% | |
| Maintenance costs are reduced by 50% | |
| System stability has been significantly enhanced |
The customer has put forward requirements for the BMS acquisition board, such as anti-interference wiring, low-temperature heat rise design, simplified layout to improve yield, and passing EMC certification. However, the original system has problems such as severe signal interference, low acquisition accuracy, high temperature rise, short lifespan, and low yield due to complex layout.
We design a four-layer PCB (with signal/ground/power/shielding layers) to isolate high and low voltage areas and embed a copper-based heat dissipation structure to reduce thermal resistance. Optimize the impedance matching and filter circuit (π -type filter + common mode inductor), and integrate the self-diagnostic pin for rapid fault identification.
The implementation effect is as follows:
| Improvement results | Data |
|---|---|
| Signal noise | Reduced by 80% |
| Temperature rise | ≤10°C |
| The production yield rate | Raised to 98% |
| EMC certification | First to pass Class 4 |
The customer requires a highly reliable high and low voltage power measurement board, but only provides the BOM at the PCBA level. The specifications of standard components are incomplete and the parameters of non-standard components are unclear, which leads to production delays, cost runaway and high supply chain risks.
We restructured the complete purchasable BOM through reverse engineering:
Final realization:
| Project Challenges | Solutions | Achievements |
|---|---|---|
| The BOM is incomplete | Reverse engineering and refactoring are carried out | It can be purchased and mass-produced |
| Risks of non-standard components | First sample + verification + access management | Quality controllable |
| Supply chain fragility | Establishing an approved material warehouse | Enhancing resilience |
In the ultra-high voltage (UHV) direct current transmission system, the customer requires the thyristor trigger board to have stable signal transmission and a long service life. However, the original product has problems such as unstable optical pulse signals and insufficient durability.
We adopt a dual-system parallel architecture of Xilinx FPGA, supporting 28-channel signal output. The PCB uses ** high Tg FR-4 material ** and combines ** red epoxy resin and solder paste mixing process **, significantly enhancing reliability and lifespan.
This scheme has been successfully applied to multiple national-level UHV DC key projects, including:
The total investment of the project exceeds 150 million yuan, and it has been operating stably and continuously under high-pressure conditions.
| Technical Highlights | Specifications |
|---|---|
| Control core | Xilinx FPGA dual system |
| Output channels | 28 channels |
| PCB material | High Tg FR-4 |
| Process | Red epoxy + solder paste mixture |
| Application projects | 4 key national UHV projects |
| The total investment | >150 million RMB |
The above four major New Energy Industry solutions, from the bottom-level PCB design to system-level integration, comprehensively support the strict requirements of the new power system for high precision, high reliability, strong anti-interference and long service life, providing a solid technical foundation for the country's energy transformation and the construction of smart grids.
Covering the key links of power electronics, we provide highly reliable and anti-interference energy system solutions.