AIoT & Robot Components

Introduction to AI & IoT Solutions

Today, with the deep integration of artificial intelligence (AI) and the Internet of Things (IoT), we offer highly customized and highly reliable embedded system solutions for multiple vertical industries. The following four typical application scenarios demonstrate our technical strength and engineering capabilities in fields such as robot control, industrial terminals, smart agriculture, and intelligent devices.

AI Main Control System (PCB Solution) - Robot Application

In the field of robotics, customers have put forward strict requirements for high integration and high reliability of the main control system. The system needs to achieve high-density interconnection within a limited space while addressing the challenges of complex circuit layout and electromagnetic interference (EMI).

We adopted the S1000H substrate, which, with its excellent electrical performance, mechanical strength and heat resistance, constructed a 6-layer board with a thickness of 1.6mm, and used 10oz copper thickness to ensure high current carrying capacity and high-speed signal stability. The line width and spacing are set at 6 mil, effectively enhancing the electrical isolation performance.

By meeting the compact layout requirements through HDI technology, this solution significantly suppresses radio frequency (RF) and electromagnetic interference, enhancing the overall signal transmission stability by approximately 35%.

Intelligent Self-service Terminal (IPD Solution) : Industrial Control

For industrial control scenarios, customers require a highly reliable, multi-functional, low-power consumption, scalable and anti-interference intelligent self-service terminal that supports multi-module integration, deep learning algorithm operation, long battery life and stable network connection.

We choose Rockchip RK3568 as the core platform, which is equipped with quad-core ARM Cortex-A55 CPU (up to 2.0GHz) and dual-core Mali-G52 2EE GPU. Fully support OpenGL ES 3.2, Vulkan 1.1 and OpenCL 2.0.

The terminal is equipped with 8K@30FPS HDMI output, 4-channel gigabit Ethernet, full-band 5G and Wi-Fi 6 connection capabilities, and has been successfully applied in high-definition video surveillance systems.

Smart Environmental Controller (EMS Solution) : Smart Agriculture and Animal Husbandry

In high-humidity and corrosive environments, customers have put forward extremely high reliability requirements for environmental control systems used in agriculture and animal husbandry, especially in terms of protection, isolation and long-term stability.

We use high Tg material (Tg ≥ 170℃) and ENIG surface treatment to significantly enhance the heat resistance, moisture resistance and corrosion resistance of the PCB. Through IPM design, combined with optimized conformal coating and SCH isolation strategy for high and low voltage circuits, and supplemented by DFX optimization and high voltage testing, the assembly defect rate is reduced by 50%.

Key components are selected as anti-sulfurization resistors and tantalum capacitors, and combined with failure analysis (FA) and reliability improvement plans, ultimately achieving:

• The product failure rate has decreased by 50%
• Maintenance and repair costs have been reduced by 40%
• The production cycle has been significantly shortened

Intelligent Lawn Mower Main Control System (IPDM Solution) : Industrial Control

For industrial-grade intelligent lawn mowers, customers require stable equipment control, remote management and efficient data collection and transmission. High-precision sensors put forward higher requirements for the processing capacity and interface design of the main control system.

We select the Horizon Sunrise X3 processor, based on the ARM Cortex-A53 CPU, integrating the FPU and NEON acceleration unit, with a typical operating frequency of 1.2GHz and support for software dynamic frequency modulation.

The system integrates multiple types of sensor interfaces and can accurately collect environmental and image data. The core board is equipped with a high-efficiency heat sink, which effectively controls the temperature rise of the chip and ensures long-term operational stability.

This solution significantly simplifies the complexity of hardware design and accelerates the commercialization and mass production process of the product.

The above four major solutions fully demonstrate our engineering innovation and system integration capabilities in the context of the integration of AI and IoT, and are committed to providing customers with high-performance, highly reliable, and rapidly implement-able intelligent hardware platforms.