Solution OverviewWith the advent of Industry 4.0, the field of industrial control is undergoing unprecedented changes. From microelectronic packaging to robot drive and control, and then to edge computing and intelligent agricultural control, we are committed to providing innovative solutions to address complex and ever-changing industrial scenarios. The following four cases demonstrate our technical strength in different application fields.
In the field of industrial robots, the customer requires a high-precision multi-layer HDI bonding control PCB. Its specifications include an inner layer line width of ≥2mil, an inner layer spacing of ≥2mil, and an outer layer spacing of ≥2.5mil, totaling 22 layers. Moreover, it has extremely high requirements for the alignment of vias, making the production process highly challenging.
We achieve precise HDI structures by using multiple laser vias alignment processes, high-precision multi-layer lamination, and BGA laser-filled vias combined with resin plug hole electroplating technology.
The results significantly increased the welding pass rate, the project progressed smoothly, and the debugging and rework time was greatly reduced, lowering the costs of rework, maintenance and scrapping.
| Key parameters | Specifications |
|---|---|
| Inner layer line width | ≥2 mil |
| Inner layer spacing | ≥2 mil |
| Outer layer spacing | ≥2.5 mil |
| Number of floors | 22 floors |
| Achievements | The welding pass rate has been improved, and the debugging and rework time has been shortened |
In the field of industrial robots, customers hope to replace them with domestic components while maintaining reliability and full functionality. The main challenges lie in EBOM optimization, PCBA soldering reliability, functional test setup, and test fixture/process optimization.
We have achieved SMT with the smallest 0201 package, with a minimum pitch of 0.4mm for QFP/BGA, and a hybrid double-sided SMT+ single-sided THT assembly. Key components such as LDO chips and complex connectors have been replaced by domestic substitutes. EBOM optimization, PCBA soldering simulation and reliability enhancement were carried out, and a functional test environment was established and the test procedures were optimized.
Ultimately, the domestic procurement of long-cycle components was successfully achieved, reducing procurement costs, increasing the test interception rate, improving the overall product yield rate, and effectively lowering the repair costs of defective products.
| Implementation Measures | Details |
|---|---|
| SMT package size | Minimum 0201 |
| Minimum pitch for QFP/BGA | 0.4mm |
| Component replacement | LDO chips, complex connectors |
| EBOM optimization | Yes |
| Achievements | Domestic procurement, reduced procurement costs, increased test interception rate, and improved product yield |
In the industrial control system, the customer plans to develop a high-performance edge controller for the control and monitoring of factory equipment. This product can achieve real-time transmission and analysis of data from Internet of Things devices, supporting applications such as smart cities and intelligent transportation. It is necessary to enhance the connectivity, computing power and adaptability of the equipment by leveraging 5G networks and various industrial control interfaces.
We have adopted TSN real-time communication technology to achieve deterministic, low-latency and highly reliable data transmission. Combining 5G technology, the controller enjoys the advantages of high bandwidth, low latency and large-scale connection. The system is based on the RK3588 processor and features an octa-core architecture (quad-core Cortex-A76 plus quad-core Cortex-A55), with a maximum main frequency of up to 2.4GHz, providing powerful computing performance.
This solution shortens the product development cycle, achieves high-speed and stable data transmission, and enhances the production efficiency and quality of industrial control systems.
| Core Configuration | Specifications |
|---|---|
| TSN technology | Deterministic Low Latency |
| 5G technology | High bandwidth, low latency, large-scale connection |
| Processor | RK3588, octa-core (four Cortex-A76 + four Cortex-A55), up to 2.4GHz |
| Application scenarios | Smart cities, intelligent transportation |
Customers focusing on smart animal husbandry aim to develop a highly stable intelligent breeding control system. The controller needs to support multi-mode rail vehicle functions including motor drive, audio recording, remote control and real-time camera transmission, while maintaining reliability in high humidity and corrosive environments.
We adopted a quad-core A55 processor with Mali-G52 GPU, integrating motor control and H.265 video transmission. The use of high TG materials, ENIG surface treatment and reinforced conformal coating has enhanced heat resistance, moisture resistance and corrosion resistance. The assembly defects and environmental impact have been further reduced through SCH isolation design, DFX optimization and the selection of anti-sulfurization components.
As a result, the product failure rate has dropped significantly, maintenance costs have decreased, and the design plan has passed the customer's review for the first time, accelerating the process of mass production.
| Key features | Description |
|---|---|
| Processor | Quad-core A55 + Mali-G52 GPU |
| Material selection | High TG material, ENIG surface treatment |
| Special treatment | Enhanced conformal coating |
| Functions | Motor drive, audio recording, remote control, real-time camera transmission |
| Achievements | Reduced failure rate, decreased maintenance costs, and accelerated mass production |
The above four Industrial Control solutions fully demonstrate our technological innovation capabilities and engineering practice achievements in response to the demands of different industries, helping enterprises move towards a new era of intelligent manufacturing.
Covering semiconductor packaging, robot drive, edge computing, etc., it helps to upgrade the intelligence of industry.