Hardware IPDM Service

Three core service sections

Integrated Product Design (IPD)

Reliable design capability

• It has 6 domestic design centers (Shenzhen, Beijing, Tianjin, Xi 'an, Chengdu and Chongqing) and over 12 Yunmeng design centers
• Gathering hundreds of outstanding designers from home and abroad, with years of development experience accumulated
• Design services cover key links from the development of complete machines to manufacturing In-depth technical support
• Deeply cooperate with the world's mainstream chip original manufacturers
• Provide comprehensive technical support from the hardware bottom layer to the software system System guarantee capability
• Full-process systematic management
• Relying on structured, asynchronous and platform-based development processes Self-developed EDA auxiliary tools
• KBEDA SKILL (a secondary development tool based on the Cadence software platform), with over 400 application functions
• Multiple functions have been granted software Copyrights and patents, enhancing design quality and shortening the R&D cycle Design the scope of services
• PCB design, SI signal integrity simulation, EMC design, IDH design, hardware design, software design, industrial design, CAD design, etc

Printed Circuit Boards (PCB)

Outstanding engineering design

• Technical research institutes have been established in many places (Shenzhen, Beijing, Xi 'an, Tianjin, Huizhou, etc.)
• Process capabilities: Blind buried holes, metal cores, embedded copper blocks, long and short gold fingers, step grooves, high-frequency mixed pressure, back drilling, etc
• Process capability: 68-layer FR4 boards, HDI products of any grade, etc Flexible manufacturing system
• A flexible production system oriented towards R&D services
• It has its own manufacturing bases in Dayawan, Huizhou and Xi 'an (with a processing capacity of over 20,000 drawing numbers) and a system of over a hundred Yunmeng factories Rapid delivery capability
• Fastest 24-hour express sample making service, 7x24-hour full-process operation
• Be flexible in responding to the demands of R&D iterations and multi-batch, small-batch orders Full coverage of product categories
• The products include high-frequency and high-speed, rigid-flex, HDI, high thermal conductivity, embedded, and substrate for packaging, etc
• Cooperate with many well-known material suppliers High reliability of the product
• System certifications: ISO9001, IATF16949 (Automotive Electronics), etc
• Full-process quality traceability management system (raw material inspection - process control - finished product testing)
• CNAS/CMA certified Intelligent Connection Testing Center Green production system
• National-level green factory, certified by the Ministry of Industry and Information Technology as a standardized enterprise for printed circuits

Integrated Product Manufacturing (IPM)

Accelerate R&D and prototyping

• One-stop integrated design and manufacturing solution (component procurement, PCBA, engineering testing)
• Efficient BOM Supply Chain Platform (Cooperating with over 2,000 global brands and agents, with tens of millions of industry BOM data) Facilitate the verification and application of new products
• Automated DFX simulation capability (rapid diagnosis of product risks, reduction of manufacturing costs)
• Pipeline-style new product incubation capabilities and NPI (New Product Introduction) standardized management One-stop service capability (ensuring bulk supply)
• 7 * 24-hour rapid response
• Five major manufacturing bases: Huizhou, Xi 'an, Hangzhou, Chengdu, Shenzhen (with over 20 advanced production lines)
• QMS Quality Management (Six Checkpoints Control, Comprehensive Quality Assurance System)

Customer domain

Covering artificial intelligence, low-altitude economy, rail transit, automotive electronics, power energy, industrial control, communication technology, medical equipment, etc

Full-chain technical support for IPDM

Technical stratification and corresponding capabilities

Technical platform support

• Core technology platforms: IDH platform, GPU, CAD platform, EES platform, PCB platform, PCBA platform, component platform
• Key technical capabilities: Standard packaging, SCH design, SI/PI simulation, reverse design, HDI, DFM manufacturing, product inspection, high frequency and high speed, failure analysis, rigid-flex high heat dissipation, BOM solution, double-sided mixed assembly, domestic substitution, 3D assembly, material selection, three-proof dispensing, material testing, flying probe testing, FPGA/ARM technology application

Core advantages

Design first

• Systematic design (hardware + software + industrial design)
• It has six design centers of its own
• Knowledge Base: 3.27 million certified materials, 2,368 DFM rules
• Effectiveness: Reduced design iterations by 60-80% and increased the success rate of solutions by 35% High reliability
• Strict QMS quality management system
• Full-chain engineering empowerment (DFX, failure analysis, process control)
• Effectiveness: Eliminated 90% of pad defects and 70% of assembly risks Technological leadership
• National intellectual property advantage enterprise, with over 350 intellectual property rights
• Build an integrated technology chain of PCB-IPDM
• With over 300 technical solutions accumulated and nearly 3 million product models and project verifications
• Seamless closed-loop and collaborative optimization throughout the entire process of hardware innovation Fast delivery
• 5 major IPM intelligent manufacturing bases + over a hundred Yunmeng factory systems
• Flexible production system (adapted to small-batch and multi-batch demands)
• A mature and agile global supply chain system