Automotive Motor Drive Equipment
Automotive Motor Drive Equipment
Overview
Automotive Motor Drive Device (PCB Solution) | Automotive Electronics
PCB Solutions for Automotive Motor Control
For Automotive Motor Drive Equipment, customers in the automotive motor control field have imposed stringent performance requirements on PCB products, especially regarding Automotive PCB High Density Design: they must possess high heat dissipation capabilities to withstand the high-temperature environment of motor operation, support peak currents up to 100A, and simultaneously control the power circuit impedance below 1mΩ to reduce conduction losses and ensure motor control efficiency. However, high power density layouts (a core part of Automotive PCB High Density Design) and high-current designs bring numerous technical challenges: copper layers are prone to overheating and burnout due to current overload, resulting in a rapid increase in local temperature. This not only affects the stability of the PCB itself but may also lead to distortion of motor control signals, thereby impacting the overall vehicle operating safety.
Core Solution and Parameter Configuration
Addressing customer needs for Automotive Motor Drive Equipment and technical pain points in Automotive PCB High Density Design, we have leveraged 29 years of technical expertise in the PCB industry to develop a customized solution. Key parameters and technical configurations are shown in the table below:
| Project | Customer Needs Indicators | Solution Parameters | Technical Basis |
|---|---|---|---|
| Copper Layer Thickness | - | 6OZ (Maximum Copper Thickness for Mass Production) | Document 2 clearly states that the maximum copper thickness for mass-produced PCBs is 6OZ. Thicker copper design improves current carrying capacity and reduces Joule heating, which is critical for Automotive PCB High Density Design in motor drive scenarios. |
| Substrate Material | - | High Tg Material (Tg≥170℃, Shengyi S1170G selected) | Document 1 and Case 2 verify that this material specification enhances high-temperature stability; Document 2 lists it as a lead-free/halogen-free high-reliability material, suitable for Automotive Motor Drive Equipment operating environments. |
| Enhanced Thermal Conductivity | - | High Thermal Conductivity PP Sheet (Shengyi ST115GB) | Document 2 clearly states that this material has high thermal conductivity, which optimizes heat transfer between substrates, a key requirement for Automotive PCB High Density Design. |
| Power Loop Impedance | ≤1mΩ | Optimized layout + thick copper process, measured impedance 0.8mΩ | Achieved by combining the signal integrity control technology in Document 1 with the low impedance characteristics of thick copper, meeting the precision requirements of Automotive Motor Drive Equipment. |
| Heat Dissipation Optimization | High heat dissipation capacity | Copper-filled design + heat dissipation hole array layout | Document 1 clearly states that this solution can avoid performance degradation caused by overheating, a core optimization direction for Automotive PCB High Density Design in motor control. |
| Surface Treatment | - | Immersion Gold Process | Document 1 mentions that immersion gold process can improve soldering reliability and corrosion resistance, adapting to complex operating conditions of Automotive Motor Drive Equipment. |
| Specific solution implementation for Automotive Motor Drive Equipment (integrating Automotive PCB High Density Design) is as follows: |
Adopting a 6OZ thick copper PCB design: Compared with conventional copper thickness, 6OZ thick copper significantly improves current carrying capacity, effectively reduces Joule heat generation, and alleviates the problem of copper layer overheating and burnout from the root—an essential design for high-density automotive motor control PCBs;
Optimizing high Tg substrate material: Selecting Shengyi S1170G material with Tg≥170℃, this material has excellent high temperature resistance, can adapt to the high temperature environment of Automotive Motor Drive Equipment operation, and avoids substrate deformation or performance degradation due to high temperature;
Introducing high thermal conductivity PP sheet: Paired with Shengyi ST115GB high thermal conductivity PP sheet, it enhances interlayer heat transfer efficiency, accelerates heat dissipation, and reduces localized temperature rise, supporting compact layouts in Automotive PCB High Density Design;
Optimized structure and process: Copper filling and a heat dissipation hole array layout further improve heat dissipation. Differential pair wiring and impedance matching design ensure that the power circuit impedance meets standards and reduces signal interference, which is crucial for the stability of Automotive Motor Drive Equipment.
Implementation Results
This solution fully meets the system's thermal management and precision requirements for Automotive Motor Drive Equipment, and optimizes the practicality of Automotive PCB High Density Design, enabling smooth equipment assembly:
Heat Dissipation Performance: The highest local temperature during product operation is reduced by 35% compared to conventional solutions. After 48 hours of continuous operation, there is no overheating or burnout, demonstrating satisfactory heat dissipation stability for Automotive Motor Drive Equipment;
Electrical Performance: The measured impedance of the power circuit is as low as 0.8mΩ, lower than the customer's requirement of 1mΩ, reducing conduction losses by 20% and significantly improving motor control efficiency—meeting the high-precision demands of Automotive PCB High Density Design;
Cost and Cycle Time: Leveraging vertical integration capabilities, processing costs are reduced by 18% (meeting Document 1's IPM business standard of 15%-20% cost reduction) and assembly cycle time is reduced by 25% (meeting Document 1's IPM technical advantage of 20%-30% cycle time reduction), enhancing the market competitiveness of Automotive Motor Drive Equipment;
Reliability: The product has passed the automotive industry's IATF16949 system certification (Document 1's standard system), and has undergone environmental reliability testing (high and low temperatures, vibration, salt spray) in a CNAS/CMA accredited laboratory, achieving a yield rate of 99.2%, fully adapting to the stringent operating conditions of Automotive Motor Drive Equipment with high-density PCB designs.
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