AI Main Control System

AI Main Control System (PCB Solution) | Security Patrol Humanoid Robot

Project Background and Core Requirements

The client focuses on developing humanoid robots for security patrol scenarios. Their core requirement is to create a highly integrated, highly reliable PCB main control system to support core functions such as autonomous robot patrolling, environmental monitoring, and anomaly warning. As a typical application in the AIoT & Robot Components Manufacturing field, the product needs to meet the following key requirements:

• High-density interconnection: Integrating complex circuits such as multiple sensors, communication modules, and computing units to achieve highly condensed functionality;

• Strong anti-interference capability: Resisting electromagnetic signals and radio frequency interference in security scenarios to ensure accurate data transmission and control commands;

• Stable operation guarantee: Adapting to complex outdoor environments such as high and low temperatures and humidity to meet the reliability requirements of long-term continuous patrols;

• High-efficiency signal transmission: Low latency and low loss to ensure real-time feedback of data such as visual recognition and positioning navigation.

Key Project Challenges:

• High-density component integration leads to complex wiring and a high risk of signal crosstalk;

• The complex electromagnetic environment of security scenarios, with issues such as radio frequency interference and electrostatic discharge affecting system stability;

• High-power computing units and high-density layout create heat dissipation pressure, potentially leading to performance degradation.

Core PCB Solution

Leveraging core technologies such as High-speed PCB Design and EMI/EMC PCB Design, combined with PCB optimization experience documented in the documentation, this solution specifically addresses the project's pain points, creating a dedicated main control PCB solution for the security patrol humanoid robot.

Substrate and Core Material Selection

• Shengyi S1000H is selected as the substrate material. This material possesses excellent electrical properties, mechanical strength, and heat resistance, with a Tg≥170℃, and can withstand outdoor ambient temperature fluctuations from -20℃ to 65℃.

• Immersion gold surface treatment enhances welding reliability and corrosion resistance, making it suitable for outdoor, humid, and dusty security environments.

• Auxiliary materials include environmentally resistant components such as anti-sulfur resistors and tantalum capacitors to reduce the risk of failure under harsh conditions.

Structure and Process Design

• The board thickness is set at 1.6mm, employing a 6-layer structure design with a copper thickness of 10oz (approximately 35μm) to meet the requirements of high-density current carrying and signal transmission;

• The trace width and spacing are both set at 6mil (0.15mm) to ensure sufficient electrical isolation and avoid signal crosstalk under high-density layout;

• Utilizing HDI PCB technology (Anylayer Interconnect), high-density component layout is achieved, reducing PCB size and adapting to the lightweight design requirements of humanoid robots;

• Heat dissipation optimization: Through copper filling, heat dissipation hole array layout, and zoned planning of heat-generating components, combined with localized buried copper technology, heat dissipation efficiency is improved, keeping the operating temperature of the computing unit below 85℃.

Interference Reduction and Signal Integrity Optimization

• Signal Integrity Control: Differential pair routing and impedance matching (tolerance ±5%) design reduce signal reflection and interference, improving AI signal integrity PCB design levels;

• Electromagnetic Compatibility Enhancement: Optimized ground plane, filter capacitor layout, and shielding layer design reduce electromagnetic radiation and sensitivity, achieving an EMC pass rate of 98.5%;

• Electrostatic Discharge Protection: ESD protection devices are added to key interfaces, meeting the IEC 61000-4-2 electrostatic discharge immunity test standard, resisting electrostatic interference in security scenarios.

Manufacturing Process Assurance

• Complying with IPC-A-610G Ⅲ standards, a highly reliable nitrogen reflow soldering process is used to ensure solder joint quality;

• Implementing 100% FCT functional testing and flying probe testing to identify potential circuit faults and improve factory yield;

• Conformal Coating: The PCB surface is coated with a conformal coating, providing moisture resistance, salt spray resistance, and corrosion resistance, suitable for complex outdoor environments. ## Core Parameter Table

| Item | Technical Parameters |

|---------------------|--------------------------------------------------------------------------|

| Substrate Material | Shengyi S1000H (Tg≥170℃, with excellent electrical performance and heat resistance) |

| PCB Structure | 6-layer design, board thickness 1.6mm, copper thickness 10oz (35μm) |

| Trace Width/Spacing | 6mil/6mil (0.15mm/0.15mm) |

| Technology and Process | HDI arbitrary layer interconnection, immersion gold surface treatment, nitrogen reflow soldering, conformal coating |

| Signal Transmission Stability | 35% improvement over conventional designs (achieved through differential routing and impedance matching) |

| Electromagnetic Compatibility (EMC) | 98.5% pass rate, meets IEC 61000-4 series immunity standards |

| Operating Temperature Range | -20℃~65℃ (suitable for outdoor security patrol environments) |

| Heat Dissipation Capacity | Operating temperature of the computing unit ≤85℃ (copper fill + heat dissipation holes + optimized partitioned layout) |

| Surface treatment | Immersion gold process (gold thickness ≥3u"), corrosion resistance, high soldering reliability |

| Testing standards | 100% FCT functional test, flying probe test, compliant with IPC-A-610G Ⅲ standard |

Implementation results

• Performance meets standards: AI signal integrity PCB design optimization improves signal transmission stability by 35%, visual recognition data latency ≤10ms, meeting real-time patrol requirements;

• Enhanced anti-interference capability: EMC pass rate reaches 98.5%, stable operation in complex electromagnetic environments, zero failures caused by electrostatic discharge, radio frequency interference, etc.;

• Improved environmental adaptability: Immersion gold process and three-proof coating treatment enable the product to work continuously for 720 hours without abnormalities in outdoor humid and high/low temperature environments, reducing the failure rate by 60%;

• Integration meets requirements: HDI technology achieves high-density layout, PCB volume is reduced by 25% compared to conventional designs, adapting to the lightweight and miniaturized requirements of humanoid robots;

• High Mass Production Feasibility: Leveraging a library of 3.27 million certified materials and 2,368 DFM rules, pre-production simulation and manufacturing optimization ensure a mass production defect rate below 0.3%.

Technological Advantages and Core Value

• Targeted solutions address pain points in security patrol scenarios, balancing high-density integration, anti-interference, and environmental adaptability—three core requirements;

• Integrates Industrial Control PCB Solutions and High-performance AI PCB design technologies, resulting in a highly mature solution;

• Utilizes Kingboard's CNAS/CMA accredited laboratory, undergoing comprehensive environmental and electrical reliability testing to guarantee product quality;

• Supports modular expansion, allowing for the addition of navigation modules, infrared detection modules, and other interfaces to meet customized needs in various security scenarios.