Electrically triggered thyristor board (IPDM solution).jpg

Electrically Triggered Thyristor Board

Overview

Thyristor Trigger Board (IPDM Solution) | Power Industry

Customer Needs and Core Challenges

  • Core Industry Needs: Focusing on UHV DC transmission scenarios, customers require a thyristor trigger board adapted to UHV DC systems. Key requirements include stable signal transmission (distortion-free optical pulse signals), ultra-long service life (≥100,000 hours), high-voltage isolation protection (withstanding ±800kV voltage), and compliance with Power electronics PCB design's high reliability standards and EMI/EMC PCB design's anti-interference requirements.

  • Key Technical Challenges:

    • Signal Transmission: Optical pulse signals are susceptible to electromagnetic interference, resulting in transmission delays and distortion, affecting triggering accuracy.
    • Durability: Under UHV environments, high temperature, high humidity, and strong electric fields combine, making it difficult for conventional PCB materials and processes to meet long-term stable operation requirements.
    • System Compatibility: Seamless integration with existing control modules in the power transmission system is required, along with high synchronization of multi-channel signal outputs.

One-Stop IPDM Solution

Based on the Integrated Product Design & Manufacturing (IPDM) system, we integrate three core businesses: IPD, IPM, and PCB, to create customized solutions:

  • IPD (Integrated Product Design) Technology Empowerment:

    • Core Platform Selection: Utilizing an FPGA platform (Xilinx XC7K325T), we construct a dual-system parallel design architecture to ensure seamless system switching in the event of a single point of failure;
    • Signal Integrity Optimization: Employing SI/PI simulation technology, we reduce signal interference and reflection through differential pair routing and impedance matching design (impedance control tolerance ±5%);
    • Multi-Channel Synchronous Control: Supports 28 independent signal output channels with a channel synchronization error ≤1μs, adapting to the requirements of polythyristor collaborative triggering in UHV transmission.
  • IPM (Integrated Product Manufacturing) Process Assurance:

    • Precise KBOM Material Selection: Leveraging a database of 3.27 million certified materials, we select high-voltage and high-temperature resistant components, providing domestic alternatives and reducing supply chain risks.
    • PCBA Process Enhancement: Utilizing high-density SMT technology with conformal coating (a mixture of red epoxy and solder paste), coupled with highly reliable nitrogen reflow soldering, meeting the IPC-A-610G Ⅲ standard.
    • EES Full-Process Verification: Conducting DFM manufacturability analysis to proactively avoid production defects and resolving mass production issues within a 24-hour closed-loop process.
  • PCB (Printed Circuit Board) Specific Optimization:

    • Substrate Selection: Selecting high-TG FR-4 material (Tg≥170℃) to enhance mechanical strength and electrical stability under high-temperature environments.
    • Surface Treatment Process: Employing immersion gold plating to improve soldering reliability and corrosion resistance, adapting to harsh outdoor environments with ultra-high voltage.
    • Heat Dissipation and Protection Design: Increasing heat dissipation holes and copper-filled layout, optimizing the arrangement of heat-generating components; ensuring an EMC pass rate of 98.5% through EMC protection design.

Core Technical Parameter Table

Technical ModulesCore ParametersImplementation Standards/Basis
Core Control PlatformFPGA Model: Xilinx XC7K325T, Dual System ParallelComplies with IPDFPGA Platform Technical Specifications
Signal TransmissionSignal Output Channels: 28 channels, Synchronization Error ≤1μs, Optical Pulse Signal Distortion Rate ≤0.5%SI/PI Simulation Optimization, Differential Pair Routing Design
PCB CharacteristicsMaterial: High TG FR-4 (Tg≥170℃), Surface Treatment: Immersion Gold Process, Number of Layers: 16Reference PCB Core Optimization Directions and Material Standards
Process StandardsPCBA Process: High-Density SMT + Conformal Coating, Soldering Standard: IPC-A-610G ⅢIPM Process Reliability Specifications
Environmental AdaptabilityOperating temperature: -40℃~85℃, Withstand voltage: ±800kV, Service life: ≥100,000 hoursCNAS/CMA laboratory reliability testing and certification
Electromagnetic compatibilityEMC pass rate: 98.5%, Electromagnetic interference immunity level: IEC 61000-4-3 Level 3IPDM overall EMC protection system

Implementation results and project application

  • Core achievements:

    • Significantly improved signal transmission stability: Optical pulse signal distortion rate reduced from 3% to 0.5%, synchronization accuracy meets UHV transmission control requirements;
    • Significantly enhanced durability: Product service life extended to 120,000 hours, failure rate reduced by 60%, adaptable to long-term operation in complex UHV environments;
    • Optimized system compatibility: Seamless integration with existing transmission control modules, shortening the integration and debugging cycle by 30%.
  • Key Project Applications:
    This solution has been successfully implemented in several key national UHV DC projects, with a total investment exceeding RMB 150 million, including:

    • Luxi Back-to-Back Asynchronous DC Interconnection Project;
    • Jiuquan-Hunan ±800kV UHVDC Transmission Project;
    • Inner Mongolia Xilingol-Jiangsu Taizhou ±800kV UHVDC Transmission Project;
    • Wudongde Hybrid DC Transmission Project.
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