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Microelectronics Bonding Equipment
Microelectronics Bonding Equipment
Microelectronics Bonding Equipment 1
Microelectronics Bonding Equipment 2
Microelectronics Bonding Equipment 3
Microelectronics Bonding Equipment 4
Overview
Microelectronics Bonding Equipment (PCB Solution) | Semiconductor Core Packaging
In the industrial robotics sector, the customer required a high-precision multi-layer HDI bonding control PCB. The board specifications included inner-layer line width ≥2 mil, inner-layer spacing ≥2 mil, outer-layer spacing ≥2.5 mil, and a total of 22 layers, with extremely tight via alignment requirements, making production highly challenging.
We employed multiple laser via alignment processes, high-precision multi-layer lamination, and BGA laser-filled vias combined with resin-in-pad plating to achieve accurate HDI structures.
As a result, soldering pass rates were significantly improved, the project progressed efficiently, and debugging and rework time were greatly reduced, lowering rework, maintenance, and scrap costs.
| Category | Details |
|---|---|
| Project Name | Microelectronics Bonding Equipment (PCB Solution) | Semiconductor Core Packaging |
| Customer Sector | Industrial robotics |
| PCB Requirements | - High-precision multi-layer HDI bonding control PCB - Inner-layer line width ≥ 2 mil - Inner-layer spacing ≥ 2 mil - Outer-layer spacing ≥ 2.5 mil - Total layers: 22 - Extremely tight via alignment requirements |
| Manufacturing Processes | - Multiple laser via alignment processes - High-precision multi-layer lamination - BGA laser-filled vias with resin-in-pad plating |
| Outcomes | - Significantly improved soldering pass rates - Efficient project progression - Greatly reduced debugging and rework time - Lowered costs related to rework, maintenance, and scrap |
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Frequently Asked Questions.
- Can your EMS services handle both prototype and large-scale PCB production?
- Do you assist with PCB layout and design optimization?
Yes. We specialize in PCB design and layout services and incorporate design for manufacturing(DFM) principles to optimize layouts, reduce costs, and improve production workflows, ensuring that your PCB project runs smoothly and efficiently.
View More >> - Do you offer BOM services for EMS manufacturing?
Yes. We provide complete Bill of Materials (BOM) service support, including material selectionand sourcing, to streamline your production process and enhance EMS manufacturing efficiency.
View More >> - How do you ensure quality in PCB manufacturing?
To guarantee our reliability and performance, we rigorously employ advanced techniques in ourPCB design services, adhering to international standards and performing rigorous electronicengineering and testing. We are certified with ISO 9001, ISO 50001, ISO 45001, ISO 14001, ISO 13485, IATF 16949, ROHS, UL, COC and AEO. Whether it is a flexible PCB, multilayer, HDl, metal board, rigid-flex, or optical communication PCBmanufacture, we ensure every product meets the highest quality benchmarks.
View More >> - What about our PCB production equipment?
We possess advanced production equipment in key processes, ensuring that product precision and consistency meet the optimal state required by the market demands. For instance, all inner and outer layer circuits are produced using LDI, and we have the most advanced Mitsubishi laser drilling machines and laser blind hole copper filling VCP for creating mechanical
View More >> - What files are required for a PCB manufacturing quote?
Gerber files, PCB specifications, and your target quantity.
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