Monitoring & Management System

Generation Side - Energy Storage Monitoring and Management System (EMS) Solution

Core Pain Points: DC UHV KV-level voltage, high heat dissipation, high current carrying capacity requirements, insufficient long-term reliability, and low sampling accuracy due to poor cell consistency.

**Main Products: **High-voltage control board, power supply board, acquisition board, interface board

IPDM Technology Features: Successful application of domestically produced FPGA design solutions, high-voltage, high-current CAD design layout, high-density, high-precision circuit routing design. IPD: First hybrid commutation HCC technology design, breakthrough in 8kV/5500A reverse-resistance IGCT devices; high-reliability DFX analysis.

IPM: High-density SMT process + three-proof coating, DFM/DFA manufacturability analysis.

PCB: Outer layer uses ≥5OZ thick copper core board, dielectric thickness between 0.10-0.13mm, meeting insulation and withstand voltage requirements, shortening vertical heat dissipation distance; high-density signal multilayer PCB lamination design layout.

Solution Value (Quantitative): Overall board performance improved by 95%, yield increased to 100%, cost reduced. 10%, thermal runaway early warning response time ≤10ms, estimation error ≤3%.