High-frequency PCBs are built using specialized RF materials that offer low dielectric loss and excellent signal stability, enabling reliable high-speed and high-frequency transmission. The design incorporates multiple blind/buried vias for higher routing density, along with multi-step cavity structures that enhance electromagnetic performance and thermal management. This precise, high-integrity architecture makes high-frequency PCBs ideal for applications requiring stringent RF performance. They are widely used in telecommunications, millimeter-wave radar, and advanced radar systems for autonomous driving, providing robust support for high-speed signal processing and RF modules.
| Item | Specification |
|---|---|
| Application | Communication |
| Layer/thickness | 5L/1.9mm |
| Surface finish | Immersion gold |
| Line width/space | 9.0/9.2mil |
| Min hole diameter | 0.3mm |
| Technical features | Three-step groove structure |









