Articles
02 Aug 2026
- by KINGBROTHER
- Blogs
CoWoS and ABF carrier board, how do the two routes of advanced packaging divert PCB demand?
The CoWoS silicon interposer route and Coupon substrate de-interposer route are compared and analyzed, and the different shunt effects of the two routes on ABF carrier board...
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22 Jul 2026
- by KINGBROTHER
- Blogs
CHTF 2026 Outlook: PCB Requirements Map under the intersection of AI hardware, embodied intelligence and energy storage technologies
The 28th China International * Technology Fair (CHTF2026) will be held in Shenzhen in November 2026...
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12 Jul 2026
- by KINGBROTHER
- News
Responding to the price increase of PCB raw materials: Multi-source supply creates flexible choices for customers
The price of PCB raw materials increased, and copper clad laminate, copper foil, glass fiber cloth, and resin increased simultaneously. Faced with cost pressures...
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01 Jul 2026
- by KINGBROTHER
- News
Steady Accumulation, Leaping Forward at 29 | KINGBROTHER Holds a Series of Successful Events for Its 29th Anniversary
Recently, KINGBROTHER successfully held a series of celebrations for its 29th anniversary. From solemn flag-raising to warm celebrations, from passionate group building to warm family days...
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30 Jun 2026
- by KINGBROTHER
- Blogs
Observation of the Munich Electronics Show and WAIC Exhibition-Two intersection lines in the electronics industry
The Shanghai Electronics Show in Munich and the WAIC World Artificial Intelligence Conference were held in Shanghai.
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26 Jun 2026
- by KINGBROTHER
- Blogs
Digital power and energy network upgrade: smart hardware base PCB design
The digital upgrade of smart grids promotes changes in PCB design for substations and distribution network terminals. From IEC 61850 Ethernet communication boards to merge units and feeder terminals
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26 Jun 2026
- by KINGBROTHER
- Blogs
Industrial PCB reliability design in harsh environments: from material selection to verification testing
Industrial automation equipment places strict requirements on PCB reliability in harsh environments such as high temperature, vibration, corrosion, and electromagnetic interference.
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23 Jun 2026
- by KINGBROTHER
- Blogs
North American industrial automation PCB needs upgrade from Automate 2026: high-TG sheet, multi-layer design and long-life verification
Automate 2026: High-TG, 30-yr life, full traceability – new PCB standards for North American industrial automation.
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23 Jun 2026
- by KINGBROTHER
- Blogs
Automate 2026 On-site Observation: PCB supply chain signals revealed by Automation North America
Automate 2026 PCB trends: humanoid robots, edge AI, and Cobots raise layer count, speed, reliability. How Chinese suppliers meet new North American certification & traceability demands
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16 Jun 2026
- by KINGBROTHER
- Blogs
Energy Storage System PCB Design: Circuit Board Design for BMS, PCS, and EMS Subsystems
Energy storage system pcb design covers circuit board design for BMS, PCS, and EMS subsystems. From precision sampling to high-current power boards, this article breaks down the key technical consi...
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16 Jun 2026
- by KINGBROTHER
- Blogs
BMS Data Acquisition PCB: Engineering Practice for High-Precision Sampling and Isolation Design
The core of the bms pcb design of the BMS data acquisition board lies in high-precision sampling and isolation communication. From AFE chip selection to anti-interference of differential traces, fr...
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13 Jun 2026
- by KINGBROTHER
- Blogs
On-Device AI Is Changing Smartphone PCB Design
WWDC 2026 and the rise of AI PC show that on-device AI is becoming a mainstream hardware requirement. This article explains how NPUs, local memory, power density, and thermal constraints are chang...
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