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End-to-end electronic product design service covering appearance design, structural design, hardware schematic design, PCB layout, embedded firmware development, and verification testing. Supports ARM, DSP, FPGA, and GPU platform development, delivering reliable, manufacturing-ready design solutions to reduce your R&D cycle and production cost.

Quick turn PCB assembly solutions support high-speed signal transmission up to 112Gbps, covering 2 to 68-layer rigid, rigid-flex, high-frequency hybrid and HDI boards for both prototyping and mass production. Services include optimized design support, fast turnaround delivery, and strict quality control to reduce manufacturing cycles and lower overall project costs.

BOM Purchase for PCB Assembly covers end-to-end electronic component sourcing, authenticity verification, compatibility validation with PCB design and assembly processes, lead time alignment, and cost optimization, eliminating sourcing bottlenecks, reducing assembly defects, and accelerating time-to-market for electronic product projects.

Edge computing PCB optimization addresses core challenges including high-speed signal attenuation, thermal buildup, and impedance mismatch for edge AI, IoT, and industrial edge hardware. It delivers improved transmission reliability, reduced latency, and extended product lifespan, supporting stable operation across harsh industrial deployment environments.

Artificial intelligence hardware PCB solutions support high-compute, low-latency operation requirements for AI edge and core computing devices, covering high-speed multi-layer boards, HDI, rigid-flex boards, high-heat dissipation boards and other types, with full-chain design, manufacturing, and testing services to reduce R&D cycles and improve product stability.

AI signal integrity PCB design services cover end-to-end optimization from stack planning, routing adjustment to simulation verification, addressing common high-speed signal failures in high-density AI computing hardware, supporting high-precision impedance control, high-bandwidth interface adaptation, and multi-scenario reliability testing to ensure stable operation of AI equipment.

Reliable HDI PCB manufacturing services support high-density routing, high-speed signal transmission up to 112Gbps, anylayer and multi-step HDI board production for prototyping and mass production. Capabilities include tight impedance control, micro-via processing, and compliance with global industry quality standards to meet the demands of high-performance electronic devices.

Energy efficiency PCB design optimizes stack-up, material selection, routing, and component integration to reduce overall power consumption, lower operational and manufacturing costs, shorten production cycles, and deliver reliable, high-performance PCB solutions aligned with global industry standards for diverse electronic applications.

Edge AI Computing solutions leverage heterogeneous accelerated computing architecture to deliver up to 100 TOPS AI processing power, 750 Gbps high-speed I/O performance, and stable long-term operation in harsh field environments, supporting flexible deployment of deep learning and complex AI workloads across multiple industry scenarios.

AIoT and robotics PCB solutions cover rigid-flex, high-speed multilayer, HDI, high-heat dissipation, and buried component board design and manufacturing, supporting high-power computing, low-latency signal transmission, and wide-temperature stable operation for intelligent IoT and robotic hardware, with full-process optimization to reduce R&D and production costs.

Heavy copper PCB manufacturing services support 2-18OZ ultra-heavy copper, bump plating, embedded copper, and thermoelectric separation designs, ideal for high-current industrial, automotive, communication, and medical equipment requiring high heat dissipation and long-term reliability. Prototyping and mass production are available with no minimum order limits.

Flex PCB (flexible printed circuit boards) are lightweight, bendable interconnect solutions that meet high-density routing requirements for compact, high-performance electronic systems. Supporting high-speed transmission up to 112Gbps, multi-layer stackups, and strict impedance control, they adapt to complex packaging demands across automotive, 5G, medical, and consumer electronics sectors, reducing assembly size and improving system reliability.