Smart Power Distribution Side - Power Supply Testing Equipment Solution
Core Pain Points: Large accuracy deviation of MCU device data acquisition, shortened lifespan of high-voltage linkage boards, large data attenuation, and stringent environmental requirements.
Main Products: Transformer voltage divider boards, relay driver boards, GM series control boards, IPDM services
Advantages: Reduced procurement costs and shorter lead times for core component power modules; CAD layout and routing with copper strip current-carrying design for 30A~4500A; integrated aluminum heatsink for boards; cabinet-style air circulation + water cooling system.
IPD: High-reliability DC high-voltage to low-voltage power supply design; power board adopts DC high-voltage module design.
IPM: Independently designed; domestic production rate exceeding 98%; high-proof design standards.
PCB: 4~8 layers; 3OZ copper plating process for the surface layer; isolation design layout for high and low voltage; ultra-high current routing layout; super-thermal heat dissipation design; high thermal conductivity large copper strip surface lamination process.
Solution Value (Quantified): Overall board performance improved by 99%, yield increased to... 100%, cost reduction of 10%,