Transmission and Distribution Side - Flexible DC Transmission Solution (Pulse Distribution)
Core Pain Points: Long-term foreign control over FPGA core technology; production and delivery of key components constrained by foreign suppliers; high interference from flexible DC ultra-high voltage transmission and hybrid voltage divider transmission; excessive heat generation on circuit boards; costs far exceeding project expectations.
Main Products: VCM main control board, CLC optical communication adapter integrated board, high-voltage central control drive board, TCU flexible DC ultra-high voltage thyristor controller, converter valve bypass trigger board.
IPDM Service Advantages: Reduced component procurement costs, shorter delivery times, CAD layout and routing design for 50A~6250A, high-frequency and high-speed signal acquisition CAD, efficient PCB design and simulation.
IPD: High-reliability DC high-voltage to low-voltage power supply design; power board adopts DC high-voltage module design.
IPM: Independent design; domestic production rate exceeding 90%.
PCB: 16-24 layers, 3mm-6mm board manufacturing process, high-voltage and low-voltage isolation design layout, ultra-high current routing layout, super-thermal conductivity heat dissipation design, high thermal conductivity large copper strip surface lamination board manufacturing process
Solution Value (Quantified): Overall board performance improved by 99%, yield increased to 100%, cost reduced by 10%, thermal runaway early warning response time ≤2ms, estimation error ≤0.02%