Transmission and Distribution Side - Flexible DC Transmission Solution (Power Module)
Core Pain Points: High interference from AC/DC hybrid voltage divider transmission; high periodic EMC oscillation interference; excessive heat generation from board-mounted step-up/step-down converter modules; difficulty in isolating ultra-high voltage and low voltage field strengths. Main Products: Valve tower AC power supply board, DC power supply board, DC drive board.
IPDM Service Advantages: Reduced component procurement costs, shorter lead times, CAD layout and routing design for 50A~6250A, high-frequency and high-speed signal acquisition CAD, efficient PCB design and simulation.
IPD: High-reliability DC high-voltage to low-voltage power supply design; power board adopts DC high-voltage module design.
IPM: Independent design, domestic production rate exceeding 90%.
PCB: 816 layers, 3mm8mm board manufacturing process, high-voltage and low-voltage isolation design layout, ultra-high current routing layout, super-thermal heat dissipation design, high thermal conductivity large copper strip surface lamination board manufacturing process.
Solution Value (Quantified): Overall board performance improved by 90%, yield increased to... 99% improvement, 10% cost reduction, thermal runaway early warning response time ≤10ms, estimation error ≤0.1%.