This end-to-end power electronics solution addresses core industry pain points including high heat dissipation demand, large current routing challenges, high-voltage interference, and low energy conversion efficiency. It supports high-reliability operation for grid, new energy, and charging infrastructure applications, while improving yield and reducing overall production costs.
Custom Electrically Triggered Thyristor Board & Power Electronics Solution, FPGA parallel design for high-voltage working conditions.
Overview
Driven by global energy transition, smart grid technology upgrades, and rising new energy penetration, power electronic equipment is evolving towards high efficiency, high reliability, miniaturization, and integration. Core challenges for the industry include meeting demands for high power density, superior heat dissipation, high voltage resistance, and stable supply chain localization, while solving common problems such as electromagnetic interference, unreasonable layout and routing, and high energy conversion loss.
The power electronics solution is a full-stack IPDM (Integrated Product Development and Manufacturing) one-stop offering covering demand analysis, design, manufacturing, testing, and after-sales support. It is tailored to solve core pain points across the power electronics industry chain, from upstream power module design to downstream end-equipment operation, and meets the strict reliability requirements of power equipment operating in complex environments such as high temperature, high pressure, and strong electromagnetic interference. The solution balances performance, yield, and cost, helping customers accelerate product iteration and improve market competitiveness.
Technical Capabilities
- High-Voltage Isolation Layout Design: Adopts optimized partitioned layout for high-voltage and low-voltage circuits, with physical isolation and independent ground plane shielding between different voltage zones, eliminating cross-interference between high-voltage power loops and low-voltage control signals, and effectively suppressing electromagnetic interference (EMI). It meets the operation requirements of 10kV and below power equipment, and is suitable for high-voltage scenarios such as converter valves and high-voltage power distribution cabinets.
- Super Large Current Routing Optimization: Supports routing design for up to 1000A high-current scenarios, adopting wide copper foil routing, multi-layer parallel current sharing design, and rounded corner transition processing to avoid local overheating and current imbalance. It ensures stable operation of high-power equipment such as inverter modules and high-power charging piles under long-term full-load operation.
- Super Thermal Dissipation System Design: Integrates pre-design thermal simulation, embedded heat pipe matching, and air flow field optimization, combined with targeted heat dissipation structure design for core power components, reducing the operating temperature of core components by 30% compared with conventional designs, and avoiding thermal failure under long-term high-load operation.
- High-Thermal Conductivity Copper Bar Lamination Process: Adopts industry-leading high-thermal conductivity large copper bar surface lamination board making process, which improves the overall thermal conductivity of the board by 40%, while enhancing the mechanical strength and impact resistance of the board, adapting to the harsh working environment of outdoor power equipment.
- Energy Conversion Efficiency Optimization: Targets core pain points such as high AC inverter energy consumption, slow high-voltage DC charging energy conversion, and low energy conversion rate, optimizes power circuit topology and component matching, improving energy conversion efficiency by up to 25%, effectively reducing energy loss during power transmission and charging.
- Localization Component Adaptation Support: Provides full-stack localization component matching and reliability verification services, supporting the replacement of imported core power components with domestic alternatives without compromising product performance and reliability, effectively addressing supply chain risks such as extended delivery times and price fluctuations.
Quality Standards
Power electronic equipment operates in complex and changeable environments, with extremely high requirements for long-term reliability and safety. This solution follows strict quality control specifications throughout the whole process:
- Full-Process Reliability Testing: Covers high and low temperature cycle testing, damp heat aging testing, high voltage withstand testing, EMC testing, and vibration shock testing, ensuring products can operate stably for a long time in the temperature range of -40℃ to +125℃, adapting to harsh operation scenarios such as outdoor, alpine, and high humidity.
- Performance and Yield Guarantee: The optimized design and manufacturing process can increase the overall performance of the board by 99%, raise the product yield to 100%, and reduce the overall production cost by 10%, balancing product performance and economic benefits for customers.
- Industry Compliance Certification: Fully complies with national grid, new energy, and charging infrastructure industry standards, including GB/T 19826, IEC 61800 and other relevant specifications, meeting the access requirements of power system and large-scale new energy grid connection projects.
Applications
The power electronics solution can be widely used in the following scenarios:
- Grid and Power Distribution Systems: Suitable for large energy group projects including ±350V converter valves, ±400V cabinet power distribution, and smart centralized system grid connection projects, supporting stable power transmission and distribution of large-scale new energy grid connection systems.
- New Energy Power Generation and Energy Storage: Applied to photovoltaic inverters, energy storage PCS, wind power converters and other equipment, supporting high-efficiency energy conversion and grid connection control of new energy power generation systems, improving the consumption capacity of new energy.
- Charging Infrastructure: Used in AC/DC charging piles, charging power control systems, and charging station centralized management systems, addressing core pain points such as single charging mode, low energy conversion rate, and slow high-voltage DC charging response, improving charging efficiency by more than 20%.
- Industrial Power Equipment: Applied to industrial frequency converters, UPS power supplies, industrial servo drive systems and other equipment, ensuring stable power supply and operation of industrial automation production lines, reducing equipment failure rates and maintenance costs.
- Special Power Electronic Modules: Supports the manufacturing of transformer voltage divider boards, relay driver boards, power control boards, trigger exchange boards, interface boards, and other special power boards, meeting the customized needs of different power electronic equipment.
Key Advantages
- One-Stop IPDM Service Coverage: Covers the entire process from demand analysis, schematic design, PCB manufacturing, PCBA assembly, to testing and verification, reducing cross-stage communication costs, shortening the product development cycle by 30%, and accelerating the time to market for customers' products.
- Scenario-Based Customized Design: Provides targeted design solutions for different application scenarios, adapting to the differentiated needs of high-voltage grid, high-power charging, new energy grid connection and other scenarios, avoiding the problem of poor adaptability of general solutions.
- Full-Life Cycle Cost Optimization: While improving product performance and reliability, it reduces the overall production cost by 10%, and reduces the later operation and maintenance cost by more than 20% through long-life design, bringing sustained economic benefits to customers.
- Forward-Looking Technology Adaptation: Follows the development trend of power electronics industry such as high power density, miniaturization, and integration, continuously iterates design and manufacturing processes, supports the application of third-generation semiconductor devices such as SiC and GaN, and meets the technical requirements of next-generation power electronic equipment.
Contact Information
If you have customized demands for power electronics solutions for grid, new energy, charging infrastructure, or industrial power equipment, please contact our technical team. We will provide you with targeted solution design, free technical evaluation, and full-cycle technical support services to help your project be implemented efficiently and reliably.
Founded in 1997 and headquartered in Shenzhen, KINGBROTHER specializes in electronic interconnection technologies and hardware innovation. We focus on electronic product R&D, AI hardware solutions, engineering services, integrated design and manufacturing, and supply chain capabilities to deliver comprehensive PCB manufacturing, IPD (Integrated Product Development), and EMS services.
We are committed to becoming a world-class AI hardware solutions and manufacturing service provider, offering one-stop solutions for AI robots, industrial control, medical devices, new energy, and automotive electronics, helping our customers accelerate innovation and bring products to market faster.
We adhere to systematic design as our foundation, offering hardware, software, and industrial design services. With 6 self-owned design centers and a knowledge base including 3.27 million certified materials and 2,368 DFI rules, we significantly reduce design iterations by 60-80% and increase customer project success rates by 35%.
We have built an integrated technology chain from IC design IPD and PCB to integrated product manufacturing IPI. With 300+ technical solutions and over 2,500,000 product models and project verifications, we achieve closed-loop collaboration and optimization throughout the hardware innovation process.
Through strict QIS quality management systems and full-chain engineering empowerment via DF8, failure analysis, and process control, we eliminate 90% of pad defects and 70% of assembly risks, ensuring product safety for our customers.
Leveraging 5 IPI smart manufacturing bases and a cloud alliance of over 100 factories, we have established a flexible production system for small-batch, multi-batch needs. Our mature global supply chain ensures quick response and delivery, especially in component procurement.
With 29 years of expertise in high-end and specialty PCBs, we deliver reliable and flexible manufacturing solutions. We offer prototyping, quick-turn, and small-to-medium volume PCBs, including multilayer, HDI, high-copper, and rigid-flex boards, backed by a one-stop PCB service that empowers clients across industries, from AI hardware to cutting-edge electronics, to accelerate product innovation and bring ideas to market faster.
Reliable AI hardware solutions with full-lifecycle supply chain support. We provide highly reliable electronic manufacturing services. Our integrated PCBA, BOM management, NPI engineering and advanced failure analysis to guarantee reliable performance at every stage.
We focus on independent design house (IDH) and CAD design, providing AI hardware solutions and covering services such as hardware design, software design, industrial design, and EDA development.
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