High-Frequency PCB

High-frequency PCBs are built using specialized RF materials that offer low dielectric loss and excellent signal stability, enabling reliable high-speed and high-frequency transmission. The design incorporates multiple blind/buried vias for higher routing density, along with multi-step cavity structures that enhance electromagnetic performance and thermal management. This precise, high-integrity architecture makes high-frequency PCBs ideal for applications requiring stringent RF performance. They are widely used in telecommunications, millimeter-wave radar, and advanced radar systems for autonomous driving, providing robust support for high-speed signal processing and RF modules.

Application: Communication; Layer/thickness: 5L/1.9mm; Surface finish: Immersion gold; Line width/space: 9.0/9.2mil; Min hole diameter: 0.3mm; Technical features: Three-step groove structure