In modern high-end electronics manufacturing, PCBA (Printed Circuit Board Assembly) is no longer just simple component soldering, but a full-chain engineering service integrating design verification, precision assembly, intelligent testing, and reliability verification. For PCBA boards containing complex SMT (Surface Mount Technology) and DIP (Dual In-line Package) hybrid components, the manufacturing difficulty increases significantly—the coexistence of tiny 01005 components, high-density BGAs, ultra-fine pitch QFNs, and through-hole components places extreme demands on process coordination, equipment precision, and quality control.
We have 20 fully automated SMT production lines and 9 professional DIP wave soldering lines, with a daily capacity of 17 million points (SMT) and 700,000 points (DIP). For mixed SMT and DIP boards, we employ a double-sided mixed-assembly process, enabling efficient collaborative operation of surface mount components and through-hole components on the same substrate, avoiding positioning errors and component damage caused by secondary clamping.
SMT Process: Utilizing high-precision pick-and-place machines supporting ultra-miniature packages such as 01005, 0201, BGA, CSP, and FCAA, with a minimum line width of 2.5mil, a minimum BGA pitch of 0.35mm, and support for high-speed signal processing up to 40Gbps.
DIP Process: Equipped with a ten-zone lead-free wave soldering system, precisely controlling the soldering temperature profile to effectively avoid cold soldering, poor soldering, and bridging. Supports batch soldering of through-hole components and large connectors.
Full-Process Integration: From BOM procurement, stencil customization, solder paste printing, surface mount technology (SMT), reflow soldering, DIP component insertion, wave soldering, to programming, conformal coating, and board separation, achieving full-process independent control, significantly shortening delivery cycles. Regular orders can achieve 48-hour express delivery.
The yield control of complex PCBAs relies on a multi-level, multi-dimensional intelligent inspection system. We have built a four-level inspection chain covering "solder joint → function → environment → failure":
X-Ray Inspection: Used for the integrity inspection of hidden solder joints and solder balls in BGA, CSP, etc., ensuring zero missed detection of hidden defects.
3D AOI Automated Optical Inspection: Real-time identification of defects such as SMT component misalignment, reverse polarity, tombstoning, and insufficient solder, with an accuracy of ±10μm.
Flying Probe Testing + FCT Functional Testing: Customized test programs for the mixed analog, digital, and power domain characteristics of hybrid boards, covering all parameters including voltage, current, timing, and communication protocols.
Online SPI Solder Paste Inspection: Immediately assesses solder paste volume and height after printing, preventing soldering defects at the source.
All test data is linked to the MES system, achieving full-process data traceability, meeting the stringent quality traceability requirements of industries such as automotive, medical, and industrial control.
We understand that "usable" does not equal "reliable". To ensure the long-term stable operation of complex PCBAs under extreme conditions, we rely on a 200㎡ intelligent laboratory to provide reliability verification services compliant with ISO/IEC 17025 standards.
High-Temperature Aging Test: 85℃/168 hours of full-load aging to verify the stability of components and solder joints under extreme temperatures.
Thermal Shock Test: 500 cycles from -55℃ to +125℃ to simulate thermal stress changes in outdoor, automotive, and aerospace environments.
Constant Temperature, Humidity, and Salt Spray Test: Tests the product's corrosion resistance in high-humidity, high-salt environments, particularly suitable for marine equipment and industrial control products.
Vibration and Drop Test: Complies with IEC 60068-2-64, MIL-STD-810, and other standards to verify the structural reliability of products during transportation and operation.
CAF and Insulation Resistance Test: Detects whether conductive anode wire (CAF) failure occurs on the PCB under high humidity and high temperature conditions, ensuring long-term electrical safety.
We provide MTBF Prediction and Reliability Analysis (RCA) Services for products from high-end medical equipment, automotive electronics, and industrial controllers, optimizing design and processes at the source and reducing rework rates by more than 30%.
Authoritative Certifications: Possesses dual CNAS (China National Accreditation Service for Conformity Assessment) and CMA (China Metrology Accreditation) certifications, strictly adhering to international standards such as ISO 9001, IATF 16949, ISO 13485, and ISO 17025.
Process Capabilities: Supports advanced technologies such as thick copper plates (≥10oz), HDI (up to 22 layers), rigid-flex boards, ceramic substrates, and embedded components, meeting the needs of cutting-edge applications such as AI servers, new energy BMS, and medical imaging equipment.
Domestic Substitution and Cost Reduction Solutions: Through intelligent BOM matching and domestic component substitution solutions, helps customers reduce procurement costs by 15%-20% while ensuring supply chain stability.
Medical Equipment: Designed a double-sided SMT + single-sided DIP control board for an immunoassay analyzer, employing nitrogen reflow soldering and a conformal coating to achieve zero functional failures during 85℃/168h aging, with a predicted MTBF >150,000 hours.
Industrial Control: Provided a 16-layer HDI + thick copper design for the intelligent PLC main control board, supporting gigabit Ethernet communication, and passed temperature cycling and EMC immunity tests from -40℃ to 85℃, meeting the harsh environments of industrial sites.
New Energy Vehicles: Provided a 6-layer thick copper PCBA for the BMS system, capable of carrying 300A of high current, combined with a heat-dissipating copper substrate and conformal coating, achieving long-term stable operation under high-voltage conditions.
We offer more than just PCBA assembly; we build a complete value chain for you, from design optimization and process verification to mass production assurance and failure analysis, based on the Integrated Product Design and Manufacturing (IPDM) concept. Whether your PCBA is an AI edge device containing thousands of 01005 components or an industrial main control board with hybrid DIP connectors and multi-layer thick copper, we have the capability for scalable, intelligent, and highly reliable delivery.
Choosing us means choosing:
✅ One-stop end-to-end service
✅ Intelligent testing and traceability throughout the entire chain
✅ Reliability assurance compliant with automotive/medical/industrial standards
✅ Extensive electronics manufacturing experience + a cluster of millions of testing equipment
Contact us now for customized PCBA technical solutions and quotations, making complex designs easily mass-produced.
Founded in 1997 and headquartered in Shenzhen, KINGBROTHER specializes in electronic interconnection technologies and hardware innovation. We focus on electronic product R&D, AI hardware solutions, engineering services, integrated design and manufacturing, and supply chain capabilities to deliver comprehensive PCB manufacturing, IPD (Integrated Product Development), and EMS services.
We are committed to becoming a world-class AI hardware solutions and manufacturing service provider, offering one-stop solutions for AI robots, industrial control, medical devices, new energy, and automotive electronics, helping our customers accelerate innovation and bring products to market faster.
We adhere to systematic design as our foundation, offering hardware, software, and industrial design services. With 6 self-owned design centers and a knowledge base including 3.27 million certified materials and 2,368 DFI rules, we significantly reduce design iterations by 60-80% and increase customer project success rates by 35%.
We have built an integrated technology chain from IC design IPD and PCB to integrated product manufacturing IPI. With 300+ technical solutions and over 2,500,000 product models and project verifications, we achieve closed-loop collaboration and optimization throughout the hardware innovation process.
Through strict QIS quality management systems and full-chain engineering empowerment via DF8, failure analysis, and process control, we eliminate 90% of pad defects and 70% of assembly risks, ensuring product safety for our customers.
Leveraging 5 IPI smart manufacturing bases and a cloud alliance of over 100 factories, we have established a flexible production system for small-batch, multi-batch needs. Our mature global supply chain ensures quick response and delivery, especially in component procurement.
With 29 years of expertise in high-end and specialty PCBs, we deliver reliable and flexible manufacturing solutions. We offer prototyping, quick-turn, and small-to-medium volume PCBs, including multilayer, HDI, high-copper, and rigid-flex boards, backed by a one-stop PCB service that empowers clients across industries, from AI hardware to cutting-edge electronics, to accelerate product innovation and bring ideas to market faster.
Reliable AI hardware solutions with full-lifecycle supply chain support. We provide highly reliable electronic manufacturing services. Our integrated PCBA, BOM management, NPI engineering and advanced failure analysis to guarantee reliable performance at every stage.
We focus on independent design house (IDH) and CAD design, providing AI hardware solutions and covering services such as hardware design, software design, industrial design, and EDA development.
100% Complete & Professional Solutions: From Design to Manufacturing.
