PCBA Assembly Service

Kingbrother's PCBA assembly service combines SMT, through-hole, and mixed-technology assembly with strict IPC Class 2/3 standards. Full BOM sourcing, AOI, X-ray, and functional testing — one partner from bare board to finished product.

Assembly Technologies We Support

Surface Mount Technology (SMT)

Our SMT lines are equipped for today's most demanding component packages:

  • Fine-pitch ICs: Down to 0.3mm pitch QFP/QFN
  • BGA / μBGA: Full BGA assembly with X-ray verification
  • 0201 / 01005 passives: Ultra-miniature component placement
  • LGA, CSP, POP: Advanced packaging formats for high-density boards
  • RF modules: Shielded assembly for wireless components
  • LED assembly: High-precision placement for lighting and display applications

SMT Line Specifications:

  • Pick-and-place accuracy: ±0.025mm (Cpk ≥ 1.67)
  • Minimum component size: 01005 (0.4mm × 0.2mm)
  • Solder paste printing: SPI (Solder Paste Inspection) on every board
  • Reflow: Lead-free / leaded profiling per IPC-7711

Through-Hole (THT) Assembly

  • Manual and automated through-hole insertion
  • Wave soldering and selective soldering for mixed boards
  • Press-fit connector assembly
  • Compliant pin insertion with force monitoring

Mixed-Technology Assembly

Most real-world boards combine SMT and THT components. Our mixed-technology process handles the sequencing without compromising either assembly type:

  1. SMT top-side reflow
  2. SMT bottom-side reflow (or wave solder for bottom-side passives)
  3. THT insertion and selective/wave soldering
  4. Manual soldering for odd-form components

PCBA Assembly Process: Step by Step

Step 1: Engineering Review (DFA Check)

Before assembly begins, our process engineers perform a Design for Assembly (DFA) review:

  • Component footprint verification against datasheet land patterns
  • Thermal profile planning for mixed-material boards
  • BGA/QFN pad design and stencil aperture optimization
  • Panelization and depaneling strategy

Step 2: BOM Sourcing & Component Procurement

We source components through authorized distributors including Digi-Key, Mouser, Arrow, Avnet, and Future Electronics — ensuring genuine parts with full traceability.

  • Cross-reference and alternate sourcing for obsolete/long-lead components
  • Anti-counterfeit screening: X-ray, parametric testing, and visual inspection of received parts
  • Full BOM coverage or customer-supplied kits (CK / partial-turnkey)

Step 3: Solder Paste Printing

  • Laser-cut stainless steel stencils (electroformed for fine-pitch)
  • Automated solder paste printer with closed-loop pressure control
  • SPI (Solder Paste Inspection) — 100% inspection of paste volume, area, and height before placement

Step 4: Component Placement

  • High-speed placement for standard SMD passives and ICs
  • High-accuracy placement for BGAs, fine-pitch QFPs, and μBGA
  • Vision-based alignment for all critical components
  • Automated verification of component identity (vision + barcode)

Step 5: Reflow Soldering

  • Nitrogen-atmosphere reflow for oxidation-sensitive applications
  • Multi-zone profiling: ramp, soak, reflow, cooling
  • Lead-free (SAC305) or leaded (Sn63/Pb37) per customer requirement
  • Continuous thermal profile logging for traceability

Step 6: Inspection & Testing

Inspection MethodWhat It Catches
AOI (Automated Optical Inspection)Missing parts, polarity errors, bridging, lifted leads
SPI (Solder Paste Inspection)Insufficient paste, smearing, offset
X-Ray InspectionBGA void analysis, solder joint integrity under packages
ICT (In-Circuit Test)Opens, shorts, component value verification
FCT (Functional Test)Board powers up and performs its intended function
Manual Visual InspectionIPC-A-610 Class 2/3 final inspection

Step 7: Post-Assembly Processing (Optional)

  • Conformal coating: Acrylic, polyurethane, silicone, or epoxy
  • Underfill: BGA/CSP mechanical reinforcement
  • Heat sink / thermal pad attachment
  • Press-fit / connector assembly
  • Box build and system integration

Quality Standards & Certifications

Our PCBA assembly processes are governed by industry-leading quality standards:

  • IPC-A-610 Class 2 & Class 3 — Acceptability of Electronic Assemblies
  • IPC J-STD-001 — Requirements for Soldering Electrical and Electronic Assemblies
  • ISO 9001:2015 — Quality Management System
  • ISO 13485:2016 — Medical Device Quality Management
  • IATF 16949:2016 — Automotive Quality Management
  • RoHS & REACH Compliant — Lead-free and restricted substance compliance

Class 3 assembly for mission-critical applications: medical life support, aerospace, automotive safety systems — where no solder joint can be left to chance.

PCBA Assembly Capabilities at a Glance

CapabilitySpecification
Min. Component Size01005 (0.4mm × 0.2mm)
Min. BGA Pitch0.3mm
Min. QFP/QFN Pitch0.3mm
Placement Accuracy±0.025mm (3σ)
Board Size (Max)600mm × 450mm
Board Thickness0.4mm – 6.0mm
Solder Paste Inspection100% SPI every board
X-Ray InspectionAXI for BGA and hidden joints
IPC StandardClass 2 and Class 3
Conformal CoatingAcrylic, PU, Silicone, Epoxy
CertificationsISO 9001, ISO 13485, IATF 16949

Industries & Applications

AI / Edge Computing High-pin-count GPU module assembly, memory stack mounting, high-speed SerDes connector placement — we handle the complexity of AI hardware assembly without compromising signal integrity.

Automotive IATF 16949 quality management, AEC-Q qualified components, and Class 3 soldering for safety-critical automotive ECUs and ADAS sensor boards.

Medical ISO 13485 certified assembly for patient-monitoring devices, imaging equipment, and diagnostic instruments. Full lot traceability, controlled ESD handling, and FDA QSR 820 documentation support.

Industrial High-reliability assembly for PLCs, motor drives, industrial IoT gateways — including conformal coating for harsh environments.

Power Electronics Heavy copper board assembly, high-current connector installation, and thermal interface material application for power conversion and energy storage systems.

Prototype to Production: Scalable Assembly Services

Prototype Assembly

  • Minimum order: 1 piece
  • Dedicated prototype team, no shared equipment with production lines
  • Engineering DFA feedback included
  • Assembly turnaround: 3–5 business days for standard SMT builds

Small-Batch Assembly

  • 10 – 500 boards
  • Flexible scheduling, often faster than expected
  • Full AOI + X-ray + functional test included

Production Assembly

  • 500+ boards, scalable to tens of thousands per month
  • Statistical process control (SPC) with Cpk monitoring
  • Dedicated account engineer for production management
  • JIT delivery coordination available

Full Turnkey or Consigned — You Choose

Service ModeWhat You SupplyWhat We Handle
Full TurnkeyDesign files + BOMComponents, PCB, assembly, test, shipping
Partial TurnkeySome components + PCBRemaining components + assembly + test
Consigned (Kit)All components + PCBAssembly + test only

Most customers start consigned for prototypes, then move to partial or full turnkey for production — simplifying their supply chain and reducing total cost.

Why Kingbrother for PCBA Assembly?

One supplier, complete solution. We manufacture the bare PCB and assemble it in-house — eliminating inter-supplier communication delays, reducing risk, and giving you a single accountable partner.

Engineering depth. With 6 in-house design centers, our engineers understand your design, not just your Gerber files. When an assembly issue arises, we debug it at the design level — not just the process level.

Transparent quality data. Every board comes with full inspection reports: SPI data, AOI results, X-ray images for BGAs, and functional test logs. You know exactly what left our facility.

Get Your PCBA Assembly Quote

Submit your Gerber files, BOM, and assembly drawing — we'll provide a detailed quote with DFA feedback within 24 hours.

Have complex requirements? Contact our assembly engineering team to discuss your specific needs.

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ABOUT OUR COMPANY

Hardware Solution and Manufacturing Service Provider

Founded in 1997 and headquartered in Shenzhen, KINGBROTHER specializes in electronic interconnection technologies and hardware innovation. We focus on electronic product R&D, AI hardware solutions, engineering services, integrated design and manufacturing, and supply chain capabilities to deliver comprehensive PCB manufacturing, IPD (Integrated Product Development), and EMS services.

We are committed to becoming a world-class AI hardware solutions and manufacturing service provider, offering one-stop solutions for AI robots, industrial control, medical devices, new energy, and automotive electronics, helping our customers accelerate innovation and bring products to market faster.

We bridge R&D to mass production with integrated capabilities:
  • Design First
  • Tech Leadership
  • High Reliability
  • Rapid Delivery

Precision-Driven System Design to Accelerate Your Success

We adhere to systematic design as our foundation, offering hardware, software, and industrial design services. With 6 self-owned design centers and a knowledge base including 3.27 million certified materials and 2,368 DFI rules, we significantly reduce design iterations by 60-80% and increase customer project success rates by 35%.

Precision-Driven System Design to Accelerate Your Success

End-to-End Technical Integration for Unbroken Innovation

We have built an integrated technology chain from IC design IPD and PCB to integrated product manufacturing IPI. With 300+ technical solutions and over 2,500,000 product models and project verifications, we achieve closed-loop collaboration and optimization throughout the hardware innovation process.

End-to-End Technical Integration for Unbroken Innovation

Rigorous Engineering for Uncompromising Product Integrity

Through strict QIS quality management systems and full-chain engineering empowerment via DF8, failure analysis, and process control, we eliminate 90% of pad defects and 70% of assembly risks, ensuring product safety for our customers.

Rigorous Engineering for Uncompromising Product Integrity

Agile Manufacturing and Supply Chain for On-Demand Fulfillment

Leveraging 5 IPI smart manufacturing bases and a cloud alliance of over 100 factories, we have established a flexible production system for small-batch, multi-batch needs. Our mature global supply chain ensures quick response and delivery, especially in component procurement.

Agile Manufacturing and Supply Chain for On-Demand Fulfillment
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