Assembly Technologies We Support
Surface Mount Technology (SMT)
Our SMT lines are equipped for today's most demanding component packages:
- Fine-pitch ICs: Down to 0.3mm pitch QFP/QFN
- BGA / μBGA: Full BGA assembly with X-ray verification
- 0201 / 01005 passives: Ultra-miniature component placement
- LGA, CSP, POP: Advanced packaging formats for high-density boards
- RF modules: Shielded assembly for wireless components
- LED assembly: High-precision placement for lighting and display applications
SMT Line Specifications:
- Pick-and-place accuracy: ±0.025mm (Cpk ≥ 1.67)
- Minimum component size: 01005 (0.4mm × 0.2mm)
- Solder paste printing: SPI (Solder Paste Inspection) on every board
- Reflow: Lead-free / leaded profiling per IPC-7711
Through-Hole (THT) Assembly
- Manual and automated through-hole insertion
- Wave soldering and selective soldering for mixed boards
- Press-fit connector assembly
- Compliant pin insertion with force monitoring
Mixed-Technology Assembly
Most real-world boards combine SMT and THT components. Our mixed-technology process handles the sequencing without compromising either assembly type:
- SMT top-side reflow
- SMT bottom-side reflow (or wave solder for bottom-side passives)
- THT insertion and selective/wave soldering
- Manual soldering for odd-form components
PCBA Assembly Process: Step by Step
Step 1: Engineering Review (DFA Check)
Before assembly begins, our process engineers perform a Design for Assembly (DFA) review:
- Component footprint verification against datasheet land patterns
- Thermal profile planning for mixed-material boards
- BGA/QFN pad design and stencil aperture optimization
- Panelization and depaneling strategy
Step 2: BOM Sourcing & Component Procurement
We source components through authorized distributors including Digi-Key, Mouser, Arrow, Avnet, and Future Electronics — ensuring genuine parts with full traceability.
- Cross-reference and alternate sourcing for obsolete/long-lead components
- Anti-counterfeit screening: X-ray, parametric testing, and visual inspection of received parts
- Full BOM coverage or customer-supplied kits (CK / partial-turnkey)
Step 3: Solder Paste Printing
- Laser-cut stainless steel stencils (electroformed for fine-pitch)
- Automated solder paste printer with closed-loop pressure control
- SPI (Solder Paste Inspection) — 100% inspection of paste volume, area, and height before placement
Step 4: Component Placement
- High-speed placement for standard SMD passives and ICs
- High-accuracy placement for BGAs, fine-pitch QFPs, and μBGA
- Vision-based alignment for all critical components
- Automated verification of component identity (vision + barcode)
Step 5: Reflow Soldering
- Nitrogen-atmosphere reflow for oxidation-sensitive applications
- Multi-zone profiling: ramp, soak, reflow, cooling
- Lead-free (SAC305) or leaded (Sn63/Pb37) per customer requirement
- Continuous thermal profile logging for traceability
Step 6: Inspection & Testing
| Inspection Method | What It Catches |
|---|
| AOI (Automated Optical Inspection) | Missing parts, polarity errors, bridging, lifted leads |
| SPI (Solder Paste Inspection) | Insufficient paste, smearing, offset |
| X-Ray Inspection | BGA void analysis, solder joint integrity under packages |
| ICT (In-Circuit Test) | Opens, shorts, component value verification |
| FCT (Functional Test) | Board powers up and performs its intended function |
| Manual Visual Inspection | IPC-A-610 Class 2/3 final inspection |
Step 7: Post-Assembly Processing (Optional)
- Conformal coating: Acrylic, polyurethane, silicone, or epoxy
- Underfill: BGA/CSP mechanical reinforcement
- Heat sink / thermal pad attachment
- Press-fit / connector assembly
- Box build and system integration
Quality Standards & Certifications
Our PCBA assembly processes are governed by industry-leading quality standards:
- IPC-A-610 Class 2 & Class 3 — Acceptability of Electronic Assemblies
- IPC J-STD-001 — Requirements for Soldering Electrical and Electronic Assemblies
- ISO 9001:2015 — Quality Management System
- ISO 13485:2016 — Medical Device Quality Management
- IATF 16949:2016 — Automotive Quality Management
- RoHS & REACH Compliant — Lead-free and restricted substance compliance
Class 3 assembly for mission-critical applications: medical life support, aerospace, automotive safety systems — where no solder joint can be left to chance.
PCBA Assembly Capabilities at a Glance
| Capability | Specification |
|---|
| Min. Component Size | 01005 (0.4mm × 0.2mm) |
| Min. BGA Pitch | 0.3mm |
| Min. QFP/QFN Pitch | 0.3mm |
| Placement Accuracy | ±0.025mm (3σ) |
| Board Size (Max) | 600mm × 450mm |
| Board Thickness | 0.4mm – 6.0mm |
| Solder Paste Inspection | 100% SPI every board |
| X-Ray Inspection | AXI for BGA and hidden joints |
| IPC Standard | Class 2 and Class 3 |
| Conformal Coating | Acrylic, PU, Silicone, Epoxy |
| Certifications | ISO 9001, ISO 13485, IATF 16949 |
Industries & Applications
AI / Edge Computing High-pin-count GPU module assembly, memory stack mounting, high-speed SerDes connector placement — we handle the complexity of AI hardware assembly without compromising signal integrity.
Automotive IATF 16949 quality management, AEC-Q qualified components, and Class 3 soldering for safety-critical automotive ECUs and ADAS sensor boards.
Medical ISO 13485 certified assembly for patient-monitoring devices, imaging equipment, and diagnostic instruments. Full lot traceability, controlled ESD handling, and FDA QSR 820 documentation support.
Industrial High-reliability assembly for PLCs, motor drives, industrial IoT gateways — including conformal coating for harsh environments.
Power Electronics Heavy copper board assembly, high-current connector installation, and thermal interface material application for power conversion and energy storage systems.
Prototype to Production: Scalable Assembly Services
Prototype Assembly
- Minimum order: 1 piece
- Dedicated prototype team, no shared equipment with production lines
- Engineering DFA feedback included
- Assembly turnaround: 3–5 business days for standard SMT builds
Small-Batch Assembly
- 10 – 500 boards
- Flexible scheduling, often faster than expected
- Full AOI + X-ray + functional test included
Production Assembly
- 500+ boards, scalable to tens of thousands per month
- Statistical process control (SPC) with Cpk monitoring
- Dedicated account engineer for production management
- JIT delivery coordination available
Full Turnkey or Consigned — You Choose
| Service Mode | What You Supply | What We Handle |
|---|
| Full Turnkey | Design files + BOM | Components, PCB, assembly, test, shipping |
| Partial Turnkey | Some components + PCB | Remaining components + assembly + test |
| Consigned (Kit) | All components + PCB | Assembly + test only |
Most customers start consigned for prototypes, then move to partial or full turnkey for production — simplifying their supply chain and reducing total cost.
Why Kingbrother for PCBA Assembly?
One supplier, complete solution. We manufacture the bare PCB and assemble it in-house — eliminating inter-supplier communication delays, reducing risk, and giving you a single accountable partner.
Engineering depth. With 6 in-house design centers, our engineers understand your design, not just your Gerber files. When an assembly issue arises, we debug it at the design level — not just the process level.
Transparent quality data. Every board comes with full inspection reports: SPI data, AOI results, X-ray images for BGAs, and functional test logs. You know exactly what left our facility.
Get Your PCBA Assembly Quote
Submit your Gerber files, BOM, and assembly drawing — we'll provide a detailed quote with DFA feedback within 24 hours.
Have complex requirements? Contact our assembly engineering team to discuss your specific needs.