Full-Spectrum Layer Capabilities
We manufacture PCBs from single-layer to 56 layers, supporting everything from simple consumer electronics to ultra-dense AI server backplanes.
| Layer Count | Typical Applications |
|---|
| 1–4 layers | Consumer electronics, IoT sensors, simple control boards |
| 6–12 layers | Industrial controllers, automotive sub-systems, communication modules |
| 14–24 layers | AI inference cards, ADAS ECUs, high-speed networking |
| 26–56 layers | AI server mainboards, data center switching, high-density computing |
Advanced Technical Specifications
Our manufacturing capabilities go well beyond standard specs:
- Line width / spacing: As fine as 2.0/2.0 mil (prototype), 2.5/2.5 mil (production)
- Minimum hole size: 0.2mm mechanical drill; laser via for HDI boards
- Board thickness: 0.4mm – 6.0mm
- Aspect ratio: Up to 20:1
- Impedance control tolerance: ±5%
- Max copper weight: 20oz heavy copper for power boards
- Surface finish options: HASL, Lead-free HASL, ENIG, ENEPIG, OSP, Immersion Silver, Immersion Tin, Hard Gold
Material Expertise
Not every application can use FR-4. Our manufacturing service covers a comprehensive range of PCB materials:
- Standard: FR-4, High-Tg FR-4 (170°C / 180°C)
- High-frequency / RF: Rogers (RO4003C, RO4350B, RO3003), Teflon (PTFE), Arlon, Taconic
- Thermal management: Aluminum base (MCPCB), Copper core PCB
- Flexible / Rigid-flex: Polyimide (Kapton), Combined rigid-flex stackups
- Special applications: Ceramic substrates, Halogen-free, Low-loss laminates for 5G/mmWave
Our integrated 5 IPI smart manufacturing bases and 100+ factory cloud alliance ensure consistent quality at every step.
1. Design File Review (DFM Check)
Before a single drill hits the material, our engineering team runs a thorough Design for Manufacturability (DFM) check:
- Verify Gerber/ODB++ files against IPC-2221 design standards
- Check drill files, netlist, impedance stack-up
- Flag potential issues before production — saving you costly re-spins
2. Material Preparation & Inner Layer Processing
- Substrate cutting and panel preparation
- Inner layer imaging via LDI (Laser Direct Imaging) for ±0.025mm accuracy
- Chemical etching and inner layer inspection (AOI)
3. Lamination
- Multi-layer lamination under controlled temperature and pressure
- Target impedance stack-up confirmed via TDR testing
- Brown oxide / black oxide surface treatment for layer adhesion
4. Drilling
- CNC mechanical drilling (0.2mm minimum)
- Laser drilling for blind/buried vias (HDI)
- Back-drilling for controlled-depth via stubs in high-speed designs
5. Through-Hole Plating & Pattern Plating
- Electroless copper deposition
- Pattern plating to specified copper weight
- Controlled impedance trace formation
6. Outer Layer Processing & Surface Finish
- Outer layer imaging and etching
- Solder mask application (LPI, two-sided)
- Legend print (white or black silkscreen)
- Surface finish application per customer specification
7. Final Testing & Quality Control
Every board passes through our multi-stage quality gate before shipping:
| Test | Standard |
|---|
| Automated Optical Inspection (AOI) | IPC-A-600 Class 2/3 |
| Electrical Testing (Flying probe / E-Test) | IPC-9252 |
| Impedance Test (TDR) | ±5% tolerance |
| Cross-section analysis | IPC-6012 |
| Final visual inspection | IPC-A-600 |
Our 98.5% EMC pass rate and CMA/CNAS laboratory certifications back this up with independent verification.
Need boards fast? Our quick-turn service delivers:
- 24-hour prototype: Single/double-sided and simple multilayer boards
- 48-72 hour prototype: Standard multilayer (up to 12 layers) with basic materials
- 5–7 day advanced prototype: HDI, rigid-flex, Rogers/Teflon, heavy copper
We maintain dedicated prototype lines with independent tooling and scheduling — so rush orders don't get caught behind production queues.
Industries We Serve
Our PCB manufacturing service powers critical applications across multiple industries:
AI & Edge Computing High-density multilayer boards for GPU compute cards, edge inference modules, AI server backplanes, and data center networking equipment. We understand the signal integrity and thermal demands of today's AI hardware — including 112Gbps SerDes routing and back-drilling.
Automotive Electronics AEC-Q100 qualified manufacturing for ADAS systems, EV battery management, electric drive control units, and in-vehicle infotainment. We meet IATF 16949 quality management requirements for automotive-grade reliability.
Medical Devices ISO 13485 certified PCB manufacturing for patient-facing medical equipment, imaging systems, and diagnostic devices. We comply with IEC 60601 and FDA QSR 820 standards, with full traceability and controlled documentation.
Industrial Control & Automation Ruggedized PCBs for PLCs, motor drives, industrial IoT gateways, and robotic controllers. Rated for wide temperature ranges and harsh electromagnetic environments.
Energy & Power Electronics Heavy copper PCBs (up to 20oz) for power converters, energy storage inverters, smart grid controllers, and solar/wind power management systems.
29 Years of Specialty PCB Expertise
We were building HDI, Rogers, and rigid-flex boards before most of today's competitors existed. That depth of experience means fewer surprises and faster solutions when your design pushes the limits.
6 In-House Design Centers
Our design engineers and manufacturing teams work under the same roof. When DFM issues arise, they're resolved in hours — not weeks of back-and-forth email.
5 IPI Smart Manufacturing Bases + 100+ Factory Cloud Alliance
Flexible capacity for prototype runs, small batches, and high-volume production. Scale up without switching suppliers.
Certified Quality Systems
- ISO 9001 Quality Management System
- ISO 13485 Medical Device Quality Management
- IATF 16949 Automotive Quality Management
- CMA & CNAS Accredited Testing Laboratory
- UL Listed Laminate and fabricator certification
Global Track Record
21,800+ customers across North America, Europe, and Asia trust us with their most demanding PCB requirements. From startups to Fortune 500 companies, we deliver to the same uncompromising standard.
| Capability | Specification |
|---|
| Layer Count | 1 – 56 layers |
| Board Size | Max 600mm × 600mm |
| Min. Line Width/Space | 2.0/2.0 mil |
| Min. Drill Size | 0.2mm (mechanical), 0.075mm (laser) |
| Board Thickness | 0.4mm – 6.0mm |
| Aspect Ratio | Up to 20:1 |
| Copper Weight | 0.5oz – 20oz |
| Impedance Control | ±5% tolerance |
| Via Types | Through-hole, blind, buried, micro-via, back-drilled |
| Surface Finishes | HASL, ENIG, ENEPIG, OSP, Im.Ag, Im.Sn, Hard Gold |
| Materials | FR-4, High-Tg, Rogers, Teflon, Polyimide, Aluminum |
| Certifications | ISO 9001, ISO 13485, IATF 16949, UL, CMA, CNAS |
| Quick-turn | 24-hour available |
| Max Copper Weight | 20oz |
| EMC Pass Rate | 98.5% |
Ready to Start Your PCB Project?
Upload your Gerber files and get a detailed quote within 24 hours. Our engineering team reviews every order personally — no automated black-box quoting.
Or contact our technical team directly to discuss your design requirements, materials, or lead time needs.
Related Services: [PCBA Assembly Service] | [PCB Prototyping] | [Full Turnkey PCBA] | [HDI PCB Design] | [Rigid-Flex PCB Manufacturing]