As a leading electronic circuit industry operator in China, KINGBROTHER Technology (SZ.301041) has been deeply involved in the printed circuit board (PCB) manufacturing and integrated product design and manufacturing (IPDM) fields for over two decades. We focus on providing global customers with end-to-end PCB manufacturing services, from rapid prototyping to small-to-medium batch production, comprehensively covering high precision, high reliability, and various special process requirements, helping customers achieve seamless integration from R&D to mass production.
Covering the Entire Process: Supporting a Flexible Manufacturing System from Samples to Small-to-Medium Batch Production
KINGBROTHER possesses a mature "small batch, multiple batches" flexible production system with an annual capacity of up to 100,000 batch numbers, building an efficient delivery capability to adapt to high-frequency iteration, multi-variety, and small-batch demands. Whether it's 24-hour rapid delivery for single-sided/double-sided boards or a 2-4 day rapid response for 6-22 layer high-multilayer boards, we can complete it efficiently. The company focuses on sample and small-to-medium volume production, avoiding the redundant costs of large-scale mass production. This is particularly suitable for R&D verification and early-stage mass production in fields such as medical devices, industrial control, AI hardware, 5G communications, and new energy vehicles.
We support order sizes from 1 sample to hundreds to thousands of pieces, fulfilling our customer commitment of "rapid response even with just one board," ensuring stable and reliable manufacturing support throughout the product development cycle.
Support for Multiple High-End and Specialty Processes: Industry-Leading Technical Capabilities
KINGBROTHER possesses comprehensive advanced PCB manufacturing capabilities to meet the stringent technical requirements of complex application scenarios:
High-Density Interconnect (HDI) Technology: Supports up to 22 layers and 14 levels of arbitrary HDI, with a minimum line width/spacing of 2.5mil (0.0635mm) and a minimum aperture of 0.15mm, meeting the high-integration design requirements of AI accelerator cards, 5G optical modules, and high-speed backplanes.
Rigid-Flex Boards: Capable of manufacturing 28-layer highly complex rigid-flex structures, supporting ultra-long FPCs (up to 2000mm), flytail structures, and multi-layer discrete rigid-flex boards, widely used in aerospace, medical implant devices, and intelligent robot connection systems.
Ultra-Thick Copper Processing: Supports 1OZ–12OZ (35µm–420µm) copper thickness, suitable for high-current scenarios such as new energy vehicle BMS, motor drive modules, and industrial power supplies, effectively reducing temperature rise and losses, and improving system stability.
High-Frequency and High-Speed Material Applications: Proficient in using Rogers, Panasonic MEGTRON, Shengyi S7136H, PTFE, and other high-frequency and high-speed materials, supporting 10–112Gbps high-speed signal transmission, and possessing ±5% impedance control accuracy, meeting the needs of high-end applications such as millimeter-wave radar, high-speed optical modules, and 5G antennas.
Specialty Process Support:
- Buried Resistor/Capacitor/Chip Technology: Enables circuit miniaturization and signal integrity optimization.
- Stepped and Segmented Gold Fingers: Tolerance control ±0.1mm, applied to high-reliability connectors and test interfaces.
- Partially Buried Ceramic/Copper Substrate: Thermal conductivity ≥170W/mK, used in high-heat-dissipation scenarios such as intelligent automotive lights and power modules.
- Full Coverage of Processes including Backdrilling, Blind Vias, Laser Depth Control, and Immersion Gold + Gold Finger Composite Surface Treatment.
- High-Precision Etching: Radar antenna etching accuracy reaches ±0.5mil, achieving high-performance radiation control for millimeter-wave antennas.
IStringent Quality Assurance: International Certifications and a Comprehensive Quality Control System
We have established an internationally aligned quality management system with "high reliability" as its core principle:
Certification System: We have obtained numerous authoritative certifications, including ISO9001, IATF16949 (automotive grade), ISO13485 (medical grade), ISO14001, ISO45001, CNAS, CMA, UL, and CE, ensuring compliance and controllability throughout the entire process from design to delivery.
Equipment and Testing: Equipped with millions of precision testing equipment, including 20 SMT lines, 9 DIP lines, AOI, X-ray, 3D optical inspection, flying probe testing, thermal shock testing, salt spray testing, constant temperature and humidity testing, C-SAM, and SEM/EDS, enabling fully automated testing and failure analysis throughout the entire process.
Environmental Adaptability: The product can withstand extreme tests such as thermal cycling from -55℃ to +125℃, 10G vibration, and 1000 hours of damp heat at 85℃/85%RH, meeting the needs of harsh environments in industrial, automotive, and medical applications.
Traceability: Utilizing a full-process barcode tracking system, it achieves complete data recording and quality traceability from raw materials to finished products.
Industry Applications: Serving High-Value Sectors Globally
Our PCB manufacturing services deeply cover the following high-growth, high-barrier-to-entry industries:
Medical Electronics: Supports ISO13485 certified products, meeting the stringent requirements of implantable devices (such as pacemakers and neurostimulators) for biocompatibility, micron-level precision (0.075mm linewidth), and long-term reliability.
Automotive Electronics: Provides automotive-grade HDI + thick copper solutions for intelligent driving domain controllers, 77GHz millimeter-wave radar, and BMS battery management systems, compliant with AEC-Q100 and IATF16949 standards.
Industrial Automation: Offers solutions for industrial control, PLC, and robot main control boards, including high Tg FR-4, anti-interference design, and three-proof coating, ensuring stable operation in dusty, high-humidity, and strong electromagnetic interference environments.
AI and Data Centers: Provides carrier-level manufacturing capabilities such as MSAP process, arbitrary layer interconnect, and ultra-thin dielectric layers for AI accelerator cards, 400G/800G optical modules, and server backplanes.
New Energy and Energy Management: Supports the design of high-power PCBs for photovoltaic inverters, energy storage systems, and charging piles using aluminum substrates, DBC ceramic substrates, and ultra-thick copper.
One-Stop Service: Full-Chain Empowerment of Design + Manufacturing + Testing + Delivery
KINGBROTHER: More Than Just Manufacturing. We offer our core service model of IPDM (Integrated Product Design and Manufacturing), providing clients with:
DFM/DFA Manufacturability Analysis: Involvement at the design stage to reduce mass production risks.
BOM Domestic Alternative Solutions: Shortening supply chain cycles and reducing costs.
Full-Process PCBA Services: Covering stencil customization, SMT/DIP, conformal coating, programming, FCT functional testing, and burn-in testing.
24-Hour Closed-Loop Response Mechanism: Mass production issues are located and resolved within 24 hours, ensuring on-time delivery.
Conclusion
KINGBROTHER Technology, with its philosophy of "Customer-centric, Technology-driven", is committed to becoming a trusted high-end PCB manufacturing partner for global clients. We not only provide the capability to "do it," but also the professional service to "do it better."
From rapid prototyping of a single sample to stable delivery of thousands of small to medium-sized batches; from standard double-sided boards to specialized processes such as 12oz thick copper, 28-layer rigid-flex, and millimeter-wave radar boards—we are always there.
Choosing KINGBROTHER means choosing reliable, precise, and cutting-edge PCB manufacturing capabilities.