KINGBROTHER showcases itself at the 2026 CPCA SHOW, jointly building a new cornerstone for AI edge hardware.

From March 24th to 26th, 2026, the highly anticipated 2026 CPCA SHOW International Electronic Circuits Exhibition (Shanghai) was grandly held at the National Exhibition and Convention Center. As an annual industry trendsetter, this exhibition brought together over 700 top companies and more than 70,000 professional visitors from around the world, covering an exhibition area of ​​over 50,000 square meters. Kingboard Technology showcased its one-stop integrated product design and manufacturing (IPDM) solutions and high-end PCB products at booth 7D12, focusing on AI edge hardware and related vertical scenarios, and committed to providing hardware innovation companies with end-to-end support from design to mass production.

Industry Honors, Demonstrating Leading Strength

During the exhibition, Kingboard, based on its technological accumulation in the field of electronic circuits and its outstanding contributions to industry development, won several honors from CPCA, including "Honorary Vice Chairman" and "Most Influential Brand Award," further demonstrating the company's leading position and outstanding strength in the industry. As a vice-chairman unit of the China Electronics Circuits Industry Association, Kingboard has consistently participated actively in industry standard setting, international exchanges, technological innovation seminars, and the co-construction of the industry chain ecosystem. It actively promotes the high-end, intelligent, and green development of PCBs, working with the association and upstream and downstream enterprises to jointly solve common technical challenges in the industry and contribute to the upgrading of China's electronic circuit industry.

Breaking Through Edge-Side Innovation, Accelerating the Deployment of Hardware in Core Scenarios

Currently, AI large-scale models are rapidly being deployed to edge devices, with embodied intelligence, edge inference, and edge computing technologies rapidly emerging. The electronics industry has officially entered a new era of transformation characterized by "edge-cloud collaboration and edge intelligence." Edge-side intelligent hardware places unprecedentedly stringent requirements on core interconnect carriers: it must meet the high-speed, high-frequency signal transmission needs of high-computing-power chips, adapt to the core demands of miniaturization, low power consumption, and high integration in terminal devices, and simultaneously accommodate the industry characteristics of rapid R&D iteration and flexible small-batch mass production. Facing these pain points, Kingboard, with its highly reliable PCB products and one-stop IPDM service model, helps customers in various industry scenarios overcome R&D bottlenecks and shorten product launch cycles.

At this exhibition, Kingboard showcased its core products, including ultra-high-rise PCBs, high-end HDI, and substrate-like PCBs, precisely matching the "high-speed, high-density, miniaturized, and low-power" requirements of edge devices, helping customers upgrade their products. Its AI accelerator card-specific PCBs, leveraging core technologies, handle small-batch orders and can adapt to iterative computing power needs. Its multi-layer high-density interconnect substrate-like PCBs, using 30μm fine-line technology, increase wiring density, helping customers overcome AI hardware integration bottlenecks.

In the robotics field, Kingboard deeply integrates PCB technology with AI control requirements, providing crucial components such as head and chest control boards, already applied in humanoid robots and intelligent inspection robots. Through its IPDM full-chain service, it integrates design and manufacturing resources, providing a one-stop solution to pain points such as low integration, slow delivery, and insufficient stability. As one robotics engineer at the event stated, "Humanoid robot R&D iterates rapidly. Kingboard has compressed the control board verification cycle from weeks to days, significantly shortening the R&D cycle and reducing trial-and-error costs." KINGBROTHER high-frequency, high-speed backplane and high-precision impedance control technology ensure stable operation of equipment under high loads. New products showcased, such as the low-altitude economic power module and the hollow cavity-type carrier board, effectively solve the problems of insufficient internal space and heat dissipation in equipment.

In AI collaborative scenarios such as power energy and low-altitude economic applications, KINGBROTHER high-frequency, high-speed backplane and high-precision impedance control technology ensure stable operation of equipment under high loads. New products showcased, such as the low-altitude economic power module and the hollow cavity-type carrier board, effectively solve the problems of unstable power supply and insufficient equipment integration.

Focusing on Process Breakthroughs, Creating a High-Performance Interconnection Base

During the exhibition, KINGBROTHER expert team shared process optimization solutions for common industry challenges, focusing on the core requirements of "miniaturization, high integration, and high reliability" for edge-side intelligent hardware, and emphasizing three main directions.

Embedded Component PCB Process Optimization: Addressing the miniaturization needs of portable electronic devices, key processes such as optimized soldering precision and cavity filling reduce embedded component failure rates, improving product yield and reliability. Multilayer High-Density Interconnect Carrier-like PCB Manufacturing Technology: Overcoming the pain point of traditional HDI's inability to meet high-density interconnect requirements, this technology overcomes core technologies such as 30μm fine lines and multilayer lamination expansion and contraction compensation, enabling mass production of carrier-like PCBs and helping 3C customers meet the demands for thinner, lighter, and higher-performance products. Cavity-Embedded Multi-Stage HDI Rigid-Flex Board Technology: Innovative cavity structure design solves the pain points of low product integration and electromagnetic interference for customers in high-end fields such as aerospace and foldable electronics, providing an integrated solution of "rigid support + flexible connection + electromagnetic protection," offering technical support for customers to expand into high-end application scenarios.

The exhibition fostered a vibrant exchange atmosphere, with many professional visitors engaging in in-depth discussions on practical business needs such as AI computing power PCB customization and robot whole-machine services. Interactive sessions were set up on-site, allowing visitors to scan QR codes to obtain IPDM solution packages for six major industries and have the opportunity to win customized gifts.

In the future, Kingboard will continue to focus on technological research and development, deepen its full-chain service capabilities, and strive to become a solid partner for customers in supply chain security and technological innovation. Together, we will help more smart hardware move from the laboratory to the market and jointly build the hardware foundation for the AI ​​era.